Document
DATA SHEET
8G bits DDR2 Mobile RAM™ PoP (12mm × 12mm, 216-ball FBGA)
EDB8164B3PF
Specifications
• Density: 8G bits • Organization — 2 pieces of 4Gb (16M words × 32 bits × 8 banks) in
one package — Independent 2-channel bus • Data rate: 1066Mbps (max.) • Package: 216-ball FBGA — Package size: 12.0mm × 12.0mm — Ball pitch: 0.4mm — Lead-free (RoHS compliant) and Halogen-free • Power supply — VDD1 = 1.70V to 1.95V — VDD2, VDDQ = 1.14V to 1.30V • Interface: HSUL_12 • Operating case temperature range — TC = -30°C to +85°C
Features
• JEDEC LPDDR2-S4B compliance • DLL is not implemented • Low power consumption • Mobile RAM functions — Partial Array Self-Refresh (PASR) — Auto Temperature Compensated Self-Refresh
(ATCSR) by built-in temperature sensor — Deep power-down mode — Per Bank Refresh • This FBGA is suitable for Package on Package (PoP)
Block Diagram
VDD1 VDD2 VDDQ VREFCA_a, VREFCA_b VREFDQ_a, VREFDQ_b
VSS
CK_a, /CK_a CA0_a to.