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Low VF Chip Schottky Barrier Rectifier
Features
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
• Low profile surface mounted application in order to
optimize board space.
• Low power loss, high efficiency. • High current capability, very low forward voltage drop. • High surge capability. • Guardring for overvoltage protection. • Very tiny plastic SMD package. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction. • Lead-free parts meet environmental standards of
MIL-STD-19500 /228
Mechanical data
• Epoxy : UL94-V0 rated flame retardant • Case : Molded plastic, SOD-323 • Terminals :Plated terminals, solderable per MIL-STD-750,
Method 2026
• Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.008 gram
SL12N THRU SL14N
1.0A Surface Mount Schottky Barrier Rectifiers - 20V-40V
Package outline
SOD-323
0.106 (2.7) 0.091 (2.3).