Upstream CATV Amplifiers
For minimal coupling between different sections of the
IC, the ideal power-supply layout is a star configuration.
This configuration has a large-value decoupling capac-
itor at the central power-supply node. The power-sup-
ply traces branch out from this node, each going to a
separate power-supply node in the circuit. At the end of
each of these traces is a decoupling capacitor that pro-
vides a very low impedance at the frequency of inter-
est. This arrangement provides local power-supply
decoupling at each power-supply pin.
The power-supply traces must be made as thick as
Ground inductance degrades distortion performance.
Therefore, ground plane connections to pin 4 and pin
20 should be made with multiple vias if necessary.
Exposed Paddle Thermal Considerations
The exposed paddle (EP) of the MAX3516’s 20-pin
TSSOP-EP package provides a low thermal-resistance
path to the die. It is important that the PC board on which
the MAX3516 is mounted, be designed to conduct heat
from this contact. In addition, the EP should be provided
with a low inductance path to electrical ground.
It is recommended that the EP be soldered to a ground
plane on the PC board, either directly or through an
array of plated via holes.
0.001μF 2 VCC
Typical Operating Circuit
CONTROL * MAX3517 ONLY
** MAX3514/MAX3516 ONLY
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