Single-Chip Microcontrollers. UPD78P078Y Datasheet

UPD78P078Y Microcontrollers. Datasheet pdf. Equivalent

UPD78P078Y Datasheet
Recommendation UPD78P078Y Datasheet
Part UPD78P078Y
Description 8 Bit Single-Chip Microcontrollers
Feature UPD78P078Y; User’s Manual µPD78078, 78078Y Subseries 8-bit Single-chip Microcontrollers µPD78076 µPD78078 µPD78P.
Manufacture NEC
Datasheet
Download UPD78P078Y Datasheet




NEC UPD78P078Y
User’s Manual
µPD78078, 78078Y Subseries
8-bit Single-chip Microcontrollers
µPD78076
µPD78078
µPD78P078
µPD78076Y
µPD78078Y
µPD78P078Y
Document No. U10641EJ4V0UM00 (4th edition)
Date Published December 1997 N
© 1994
Printed in Japan



NEC UPD78P078Y
[MEMO]
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NEC UPD78P078Y
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note:
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.
2 HANDLING OF UNUSED INPUT PINS FOR CMOS
Note:
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided
to the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of
being an output pin. All handling related to the unused pins must be judged device by device and
related specifications governing the devices.
3 STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note:
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does
not guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the
reset signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.
FIP, EEPROM, IEBus, and QTOP are trademarks of NEC Corporation.
MS-DOS, Windows, and WindowsNT are either registered trademarks or trademarks of Microsoft
Corporation in the United States and/or other countries.
IBM DOS, IBM PC/AT, and PC DOS are trademarks of International Business Machines Corporation.
HP9000 Series 700 and HP-UX are trademarks of Hewlett-Packard Company.
SPARCstation is a trademark of SPARC International, Inc.
SunOS is a trademark of Sun Microsystems, Inc.
Ethernet is a trademark of XEROX Corporation.
OSF/Motif is a trademark of Open Software Foundation, Inc.
NEWS and NEWS-OS are trademarks of Sony Corporation.
TRON is an abbreviation of The Realtime Operating System Nucleus.
ITRON is an abbreviation of Industrial TRON.
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