MINI-BRIDGE RECTIFIERS. MB8M Datasheet


MB8M RECTIFIERS. Datasheet pdf. Equivalent


MB8M


MINI-BRIDGE RECTIFIERS
www.eicsemi.com

TH97/2478

TH09/2479

IATF 0113686 SGS TH07/1033

MB1M - MB10M

MINI-BRIDGE RECTIFIERS

PRV : 100 - 1000 Volts Io : 0.5 Ampere

MBM
0.105(2.67) 0.095(2.41)

FEATURES :
* Plastic package has Underwriters Laboratory Flammability Classification 94V-0
* Glass passivated chip junctions. * High surge overload rating : 35A peak * Saves space on printed circuit boards. * High temperature soldering guaranteed :
260 oC/10 seconds. * Pb / RoHS Free
MECHANICAL DATA :
* Case : Molded plastic body over passivated junctions * Terminals : Plated leads solderable per MIL-STD-750,
Method 2026 * Weight : 0.22 gram

0.161(4.10) 0.144(3.65)

~~

0.190(4.83) 0.179(4.55)

0.205(5.21) 0.195(4.95)

0.106(2.70) 0.090(2.30)

0.197(5.00) 0.171(4.34)

0.029(0.74) 0.017(0.43

0.016(0.41) 0.006(0.15)

0 ~ 15°

Dimensions in inches and ( millimeters )

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25°C ambient temperature unless otherwise specified. 60 Hz, resistive or inductive load.

R...



MB8M
www.eicsemi.com
TH97/2478
TH09/2479
IATF 0113686
SGS TH07/1033
MB1M - MB10M
MINI-BRIDGE RECTIFIERS
PRV : 100 - 1000 Volts
Io : 0.5 Ampere
MBM
0.105(2.67)
0.095(2.41)
FEATURES :
* Plastic package has Underwriters Laboratory
Flammability Classification 94V-0
* Glass passivated chip junctions.
* High surge overload rating : 35A peak
* Saves space on printed circuit boards.
* High temperature soldering guaranteed :
260 oC/10 seconds.
* Pb / RoHS Free
MECHANICAL DATA :
* Case : Molded plastic body over passivated junctions
* Terminals : Plated leads solderable per MIL-STD-750,
Method 2026
* Weight : 0.22 gram
0.161(4.10)
0.144(3.65)
~~
0.190(4.83)
0.179(4.55)
0.205(5.21)
0.195(4.95)
0.106(2.70)
0.090(2.30)
0.197(5.00)
0.171(4.34)
0.029(0.74)
0.017(0.43
0.016(0.41)
0.006(0.15)
0 ~ 15°
Dimensions in inches and ( millimeters )
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25°C ambient temperature unless otherwise specified.
60 Hz, resistive or inductive load.
RATING
SYMBOL MB1M MB2M MB4M MB6M MB8M MB10M UNIT
Maximum Repetitive Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Output
Rectified Current (See Fig.1)
Maximum Peak Forward Surge Current
Single half sine wave Superimposed
on rated load (JEDEC Method)
Rating for fusing (t < 8.3 ms.)
Maximum Instantaneous Forward Voltage
per element at IF = 0.4 A
Maximum DC Reverse Current Ta = 25°C
at Rated DC Blocking Voltage Ta = 125°C
Typical Junction Capacitance per element
Typical Thermal Resistance
Junction and Storage Temperature Range
VRRM
VRMS
VDC
IF(AV)
IFSM
I2t
VF
IR
IR(H)
Cj
RӨJA
TJ, TSTG
100
70
100
200 400 600 800
140 280 420 560
200 400 600 800
0.5 (1) (on glass-epoxy P.C.B.)
0.8 (2) (on aliminum substrate)
1000
700
1000
V
V
V
A
35 A
5.0
1.0
5.0
100
13 (3)
85 (1)
-55 to + 150
A2S
V
μA
μA
pF
°C/W
°C
Notes :
(1) On glass epoxy P.C Board mounted on 0.5" x 0.5" (13mm x 13mm) Pads.
(2) On aluminum substrate P.C.B. with an area 0.8" x 0.8" (20mm x 20mm) mounted on 0.5" x 0.5" (13mm x 13mm) Pads.
(3) Measured at 1.0 MHz and applied reverse voltage of 4.0VDC
Page 1 of 2
Rev. 03 : October 25, 2006

MB8M
www.eicsemi.com
TH97/2478
TH09/2479
RATING AND CHARACTERISTIC CURVES ( MB1M - MB10M )
IATF 0113686
SGS TH07/1033
FIG.1 - DERATING CURVE FOR OUTPUT
RECTIFIED CURRENT
1.0
Aluminum Substrate
0.8
0.6
0.4 Glass Epoxy
P.C.B.
0.2
00
Resistive or Inductive Load
25 50 75 100 125 150 175
AMBIENT TEMPERATURE, (°C)
FIG.2 - MAXIMUM NON-REPETITIVE PEAK
FORWARD SURGE CURRENT
PER BRIDGE ELEMENT
35
28
21
14 Ta = 40°C
Single Half Sine-Wave
7 (JEDEC Method)
01 2
4 6 10 20 40 60 100
NUMBER OF CYCLES AT 60Hz
FIG.3 - TYPICAL FORWARD CHARACTERISTICS
10
1
Pulse Width = 300 μs
1% Duty Cycle
0.1
TJ = 25°C
0.01
0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
FORWARD VOLTAGE, VOLTS
FIG.4 - TYPICAL REVERSE CHARACTERISTICS
PER BRIDGE ELEMENT
100
TJ = 125 °C
10
1.0
TJ = 25°C
0.1
0.0
0
20 40
60 80 100 120 140
PERCENT OF RATED PEAK
REVERSE VOLTAGE, (%)
Page 2 of 2
Rev. 03 : October 25, 2006




@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site (Privacy Policy & Contact)