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Am50DL128BG

AMD

Flash Memory and SRAM

PRELIMINARY Am50DL128BG Stacked Multi-Chip Package (MCP) Flash Memory and SRAM Two Am29DL640G 64 Megabit (8 M x 8-Bit/4 ...


AMD

Am50DL128BG

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Description
PRELIMINARY Am50DL128BG Stacked Multi-Chip Package (MCP) Flash Memory and SRAM Two Am29DL640G 64 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memories and 32 Mbit (2 M x 16-Bit) Pseudo Static RAM with Page Mode DISTINCTIVE CHARACTERISTICS MCP Features ■ Power supply voltage of 2.7 to 3.3 volt ■ High performance — Access time as fast as 70 ns ■ Package — 73-Ball FBGA ■ Operating Temperature — –40°C to +85°C Flash Memory Features ARCHITECTURAL ADVANTAGES ■ Simultaneous Read/Write operations — Data can be continuously read from one bank while executing erase/program functions in another bank. — Zero latency between read and write operations ■ Flexible Bank architecture — Read may occur in any of the three banks not being written or erased. — Four banks may be grouped by customer to achieve desired bank divisions. ■ Manufactured on 0.17 µm process technology ■ SecSi™ (Secured Silicon) Sector: Extra 256 Byte sec...




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