Nexperia
BAS40 series; 1PSxxSB4x series
General-purpose Schottky diodes
6. Thermal characteristics
Table 7. Thermal characteristics
Symbol Parameter
Per device
Rth(j-a)
thermal resistance from
junction to ambient
SOT23
SOT143B
SOT363 (1PS88SB48)
SOT416
SOT666 (BAS40-05V)
SOT666 (BAS40-07V)
SOD123F
SOD323
SOD523
SOD882
SOT323
Rth(j-sp)
thermal resistance from
junction to solder point
SOT363 (BAS40XY)
Conditions
in free air
Min Typ Max Unit
[1]
- - 500 K/W
- - 500 K/W
- - 416 K/W
- - 833 K/W
[2] -
- 225 K/W
[2] -
- 416 K/W
[2] -
- 330 K/W
- - 450 K/W
[2] -
- 450 K/W
[2] -
- 500 K/W
- - 625 K/W
[3] -
- 260 K/W
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Soldering point at pins 2, 3, 5 and 6.
7. Characteristics
Table 8. Characteristics
Tamb = 25 C unless otherwise specified.
Symbol Parameter
Conditions
Per diode
VF forward voltage
IF = 1 mA
IF = 10 mA
IF = 40 mA
IR reverse current
VR = 30 V
VR = 40 V
Cd diode capacitance VR = 0 V; f = 1 MHz
[1] Pulse test: tp 300 s; 0.02.
Min Typ Max Unit
[1]
- - 380 mV
- - 500 mV
- - 1V
- - 1 A
- - 10 A
- - 5 pF
BAS40_1PSXXSB4X_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 18 March 2015
© Nexperia B.V. 2017. All rights reserved
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