SMD Transient Voltage Suppressor
Chip Integration Technology Corporation
P6SMB Series
600W Surface Mount Transient Voltage Suppressors
VOLTAGE : 6.8 TO 550Volts
Features
• 600W peak pulse power capability with a 10/1000uS
waveform, repetition rate (duty cycle): 0.01%.
• Excellent clamping capability.
• Low incremental surge resistance.
• Suffix "G" indicates Halogen-free part, ex.P6SMB6.8(C)AG.
• Glass passivated chip junction
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, DO-214AA / SMB
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Weight : 0.003 ounce, 0.093 gram
Outline
SMB(DO-214AA)
0.08 7 (2.20 )
0.07 5 (1.90 )
0.15 7 (4.00 )
0.13 0 (3.30 )
0.18 9 (4.80 )
0.15 7 (4.00 )
0.012 (0.3 1)
MAX.
0.09 8 (2.50 )
0.08 3 (2.10 )
0.06 3 (1.60 )
0.02 8 (0.70 )
0.22 0 (5.60 )
0.19 7 (5.00 )
0.008 (0.2 1)
MAX.
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25OC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Parameter
Conditions
Peak power dissipation
with a 10/1000 us waveform, Note 1 & Fig. 1
Peak pulse current
with a 10/1000 us waveform
Steady state power dissipation
Peak forward surge current
at TL=75°C lead length 0,375” (9,5 mm), note 2
8.3mS single half sine-wave superimposed
on rated load (JEDEC method), note 3
Operating and Storage temperature
Note 1. Non-repetitive current pulse, per Fig. 3 and derated above TA=25OC per Fig. 2
2. Mounted on copper pad area of 0.8" X 0.8" (40x40 mm) per Fig 5
3. Measured on 8.3 ms single half sine-wave or equivalent square wave, duty cycle=4 pulses per minute maximum
Symbol
PPPM
IPPM
P M(AV)
P6SMB Series
600
See table 1
5.0
IFSM 100
TJ, TSTG
-55 ~ +150
UNIT
W
A
W
A
OC
http://www.citcorp.com.tw/
TEL:886-3-6565228
FAX:886-3-6565091
1
Document ID : DS-22T06
Issued Date : 2010/05/05
Revised Date : 2010/10/08
Revision : B
