MCU. S32K148 Datasheet

S32K148 MCU. Datasheet pdf. Equivalent


NXP S32K148
NXP Semiconductors
Data Sheet: Technical Data
Document Number S32K1XX
Rev. 11, 06/2019
S32K1xx Data Sheet
Notes
• The following two attachments are available with the
Datasheet:
– S32K1xx_Orderable_Part_Number_ List.xlsx
– S32K1xx_Power_Modes_Configuration.xlsx
Key Features
• Operating characteristics
– Voltage range: 2.7 V to 5.5 V
– Ambient temperature range: -40 °C to 105 °C for
HSRUN mode, -40 °C to 125 °C for RUN mode
• Arm™ Cortex-M4F/M0+ core, 32-bit CPU
– Supports up to 112 MHz frequency (HSRUN mode)
with 1.25 Dhrystone MIPS per MHz
– Arm Core based on the Armv7 Architecture and
Thumb®-2 ISA
– Integrated Digital Signal Processor (DSP)
– Configurable Nested Vectored Interrupt Controller
(NVIC)
– Single Precision Floating Point Unit (FPU)
• Clock interfaces
– 4 - 40 MHz fast external oscillator (SOSC) with up
to 50 MHz DC external square input clock in
external clock mode
– 48 MHz Fast Internal RC oscillator (FIRC)
– 8 MHz Slow Internal RC oscillator (SIRC)
– 128 kHz Low Power Oscillator (LPO)
– Up to 112 MHz (HSRUN) System Phased Lock
Loop (SPLL)
– Up to 20 MHz TCLK and 25 MHz SWD_CLK
– 32 kHz Real Time Counter external clock
(RTC_CLKIN)
S32K1XX
• Power management
– Low-power Arm Cortex-M4F/M0+ core with
excellent energy efficiency
– Power Management Controller (PMC) with multiple
power modes: HSRUN, RUN, STOP, VLPR, and
VLPS. Note: CSEc (Security) or EEPROM writes/
erase will trigger error flags in HSRUN mode (112
MHz) because this use case is not allowed to
execute simultaneously. The device will need to
switch to RUN mode (80 Mhz) to execute CSEc
(Security) or EEPROM writes/erase.
– Clock gating and low power operation supported on
specific peripherals.
• Memory and memory interfaces
– Up to 2 MB program flash memory with ECC
– 64 KB FlexNVM for data flash memory with ECC
and EEPROM emulation. Note: CSEc (Security) or
EEPROM writes/erase will trigger error flags in
HSRUN mode (112 MHz) because this use case is
not allowed to execute simultaneously. The device
will need to switch to RUN mode (80 MHz) to
execute CSEc (Security) or EEPROM writes/erase.
– Up to 256 KB SRAM with ECC
– Up to 4 KB of FlexRAM for use as SRAM or
EEPROM emulation
– Up to 4 KB Code cache to minimize performance
impact of memory access latencies
– QuadSPI with HyperBus™ support
• Mixed-signal analog
– Up to two 12-bit Analog-to-Digital Converter
(ADC) with up to 32 channel analog inputs per
module
– One Analog Comparator (CMP) with internal 8-bit
Digital to Analog Converter (DAC)
• Debug functionality
– Serial Wire JTAG Debug Port (SWJ-DP) combines
– Debug Watchpoint and Trace (DWT)
– Instrumentation Trace Macrocell (ITM)
– Test Port Interface Unit (TPIU)
– Flash Patch and Breakpoint (FPB) Unit
• Human-machine interface (HMI)
– Up to 156 GPIO pins with interrupt functionality
– Non-Maskable Interrupt (NMI)
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.


S32K148 Datasheet
Recommendation S32K148 Datasheet
Part S32K148
Description MCU
Feature S32K148; NXP Semiconductors Data Sheet: Technical Data Document Number S32K1XX Rev. 11, 06/2019 S32K1xx Dat.
Manufacture NXP
Datasheet
Download S32K148 Datasheet




NXP S32K148
• Communications interfaces
– Up to three Low Power Universal Asynchronous Receiver/Transmitter (LPUART/LIN) modules with DMA support
and low power availability
– Up to three Low Power Serial Peripheral Interface (LPSPI) modules with DMA support and low power availability
– Up to two Low Power Inter-Integrated Circuit (LPI2C) modules with DMA support and low power availability
– Up to three FlexCAN modules (with optional CAN-FD support)
– FlexIO module for emulation of communication protocols and peripherals (UART, I2C, SPI, I2S, LIN, PWM, etc).
– Up to one 10/100Mbps Ethernet with IEEE1588 support and two Synchronous Audio Interface (SAI) modules.
• Safety and Security
– Cryptographic Services Engine (CSEc) implements a comprehensive set of cryptographic functions as described in the
SHE (Secure Hardware Extension) Functional Specification. Note: CSEc (Security) or EEPROM writes/erase will
trigger error flags in HSRUN mode (112 MHz) because this use case is not allowed to execute simultaneously. The
device will need to switch to RUN mode (80 MHz) to execute CSEc (Security) or EEPROM writes/erase.
– 128-bit Unique Identification (ID) number
– Error-Correcting Code (ECC) on flash and SRAM memories
– System Memory Protection Unit (System MPU)
– Cyclic Redundancy Check (CRC) module
– Internal watchdog (WDOG)
– External Watchdog monitor (EWM) module
• Timing and control
– Up to eight independent 16-bit FlexTimers (FTM) modules, offering up to 64 standard channels (IC/OC/PWM)
– One 16-bit Low Power Timer (LPTMR) with flexible wake up control
– Two Programmable Delay Blocks (PDB) with flexible trigger system
– One 32-bit Low Power Interrupt Timer (LPIT) with 4 channels
– 32-bit Real Time Counter (RTC)
• Package
– 32-pin QFN, 48-pin LQFP, 64-pin LQFP, 100-pin LQFP, 100-pin MAPBGA, 144-pin LQFP, 176-pin LQFP package
options
• 16 channel DMA with up to 63 request sources using DMAMUX
S32K1xx Data Sheet, Rev. 11, 06/2019
2 NXP Semiconductors



NXP S32K148
Table of Contents
1 Block diagram.................................................................................... 4
6.2.5 SPLL electrical specifications .....................................33
2 Feature comparison............................................................................ 5
6.3 Memory and memory interfaces................................................33
3 Ordering information......................................................................... 7
6.3.1 Flash memory module (FTFC) electrical
3.1 Selecting orderable part number ...............................................7
specifications................................................................33
3.2 Ordering information ................................................................ 8
6.3.1.1 Flash timing specifications —
4 General............................................................................................... 9
commands................................................ 33
4.1 Absolute maximum ratings........................................................9
6.3.1.2 Reliability specifications..........................38
4.2 Voltage and current operating requirements..............................10
6.3.2 QuadSPI AC specifications..........................................39
4.3 Thermal operating characteristics..............................................11
6.4 Analog modules......................................................................... 43
4.4 Power and ground pins.............................................................. 12
6.4.1 ADC electrical specifications...................................... 43
4.5 LVR, LVD and POR operating requirements............................14
6.4.1.1 12-bit ADC operating conditions............. 43
4.6 Power mode transition operating behaviors.............................. 15
6.4.1.2 12-bit ADC electrical characteristics....... 45
4.7 Power consumption................................................................... 16
6.4.2 CMP with 8-bit DAC electrical specifications............ 47
4.8 ESD handling ratings.................................................................22
6.5 Communication modules........................................................... 51
4.9 EMC radiated emissions operating behaviors........................... 22
6.5.1 LPUART electrical specifications............................... 51
5 I/O parameters....................................................................................23
6.5.2 LPSPI electrical specifications.................................... 51
5.1 AC electrical characteristics...................................................... 23
6.5.3 LPI2C electrical specifications.................................... 57
5.2 General AC specifications......................................................... 23
6.5.4 FlexCAN electical specifications.................................58
5.3 DC electrical specifications at 3.3 V Range.............................. 24
6.5.5 SAI electrical specifications........................................ 58
5.4 DC electrical specifications at 5.0 V Range.............................. 25
6.5.6 Ethernet AC specifications.......................................... 60
5.5 AC electrical specifications at 3.3 V range .............................. 26
6.5.7 Clockout frequency......................................................63
5.6 AC electrical specifications at 5 V range ................................. 26
6.6 Debug modules.......................................................................... 63
5.7 Standard input pin capacitance.................................................. 27
6.6.1 SWD electrical specofications .................................... 63
5.8 Device clock specifications....................................................... 27
6.6.2 Trace electrical specifications......................................65
6 Peripheral operating requirements and behaviors.............................. 28
6.6.3 JTAG electrical specifications..................................... 66
6.1 System modules......................................................................... 28
7 Thermal attributes.............................................................................. 69
6.2 Clock interface modules............................................................ 28
7.1 Description.................................................................................69
6.2.1 External System Oscillator electrical specifications....28
7.2 Thermal characteristics..............................................................69
6.2.2 External System Oscillator frequency specifications . 30
7.3 General notes for specifications at maximum junction
6.2.3 System Clock Generation (SCG) specifications.......... 32
temperature................................................................................ 74
6.2.3.1 Fast internal RC Oscillator (FIRC)
8 Dimensions.........................................................................................75
electrical specifications............................ 32
8.1 Obtaining package dimensions ................................................. 75
6.2.3.2 Slow internal RC oscillator (SIRC)
9 Pinouts................................................................................................76
electrical specifications ........................... 32
9.1 Package pinouts and signal descriptions....................................76
6.2.4 Low Power Oscillator (LPO) electrical specifications
10 Revision History.................................................................................76
......................................................................................33
NXP Semiconductors
S32K1xx Data Sheet, Rev. 11, 06/2019
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