Document
SMAJ Series
Surface Mount – 400W
TVS Diodes Datasheet
RoHS
Pb e3
Description
The SMAJ series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events.
Uni-directional
Bi-directional
Additional Information
Resources
Accessories
Samples
Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted)
Parameter
Symbol Value Unit
Peak Pulse Power Dissipation at TA=25° by 10/1000us Waveform(Fig.2)(Note 1), (Note 2) -Single Die Parts
Peak Pulse Power Dissipation at TA=25° by 10/1000us Waveform(Fig.2)(Note 1), (Note 2)-Stacked Die Parts(Note 5)
Power Dissipation on Infinite Heat Sink at TL=50OC
Peak Forward Surge Current, 8.3ms Single Half Sine Wave (Note 3)
Maximum Instantaneous Forward Voltage at 25A for Unidirectional Only (Note 4)
Operating Temperature Range
Storage Temperature Range
Typical Thermal Resistance Junction to Lead
Typical Thermal Resistance Junction to Ambient
PPPM
400
W
PPPM
600
W
PD
3.3
W
IFSM
60
A
VF
3.5/5.0
V
TJ -65 to 150 °C TSTG -65 to 175 °C
RθJL
30 °C/W
RθJA
120 °C/W
Features
■ 400W Peak Pulse Power capability at 10/1000µs waveform, repetition rate (duty cycle): 0.01%
■ Excellent clamping capability
■ Typical IR less than 1μA when VBR min>12V
■ Surface mount footprint for compact PCB layout
■ Low profile package
■ Typical failure mode is short from over-specified voltage or current
■ Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
■ IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact)
■ ESD protection of data lines in accordance with IEC 61000-4-2
■ EFT protection of data lines in accordance with IEC 610004-4
■ Built-in strain relief
■ Fast response time: typically less than 1.0ps from 0 Volts
to VBR min
■ Glass passivated junction
■ Low inductance
■ High temperature to reflow soldering guaranteed: 260°C/30sec
■ VBR @ TJ= VBR@25°C x (1+αT x (TJ - 25)) (αT:Temperature Coefficient, typical value is 0.1%)
■ Plastic package is flammability rated V-0 per UL-94.
■ Meet MSL level1, per J-STD-020, LF maximun peak of 260°C
■ Matte tin, lead–free plated
■ Halogen free and RoHS compliant
■ Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD609A.01)
Applications
TVS devices are ideal for the protection of I/O Interfaces, VCC bus and other vulnerable circuits used in Telecom, Computer, Industrial and Consumer electronic applications.
Agency
Agency Approvals
Agency File Number E230531
Functional Diagram
Notes: 1. Non-repetitive current pulse, per Fig.4 and derated above TJ (initial) =25ºC per Fig. 3. 2. Mounted on 5.0x5.0mm copper pad to each terminal. 3. Measured on 8.3ms single half sine wave or equivalent square wave for unidirectional device only. 4. VF < 3.5V for single die parts and VF< 5.0V for stacked-die parts. 5. For stacked die component details, please refer to part numbers labeled by * in Electrical Characteri.