Power Receiver. P9028AC Datasheet

P9028AC Receiver. Datasheet pdf. Equivalent

P9028AC Datasheet
Recommendation P9028AC Datasheet
Part P9028AC
Description Dual-Mode WPC/PMA 5 Watt Wireless Power Receiver
Feature P9028AC; DRAFT Dual-Mode WPC/PMA 5 Watt Wireless Power Receiver IC P9028AC Features  Single Chip Receiver (.
Manufacture IDT
Datasheet
Download P9028AC Datasheet




IDT P9028AC
DRAFT
Dual-Mode WPC/PMA 5 Watt
Wireless Power Receiver IC
P9028AC
Features
Single Chip Receiver (Rx) Solution
WPC v1.1.2 Compliant
PMA v1, v3 Pre-Release Compatible with Options
Advanced WPC v1.1.2 Foreign Object Detection (FOD)
Programmable FOD setting via external resistor and
I2C registers
Programmable current limit via external resistor
Integrated Full-Bridge Synchronous Rectifier
Integrated 5V @ 1A LDO Regulator Output
Closed-loop power transfer control between TX and
RX
I2C interface provides VRECT, Iout and switching
frequency values
Open-Drain LED Indicator Output
Over-Temperature/Voltage/Current Protection
Applications
WPC-Compliant and PMA-Compatible Wireless
Chargers for Mobile Applications.
Cellular Mobile Phones
Tablets, DSC, DVC and Handhelds
Product Datasheet
Introduction
The P9028AC is an integrated single-chip, dual-mode WPC
v1.1.2-compliant and PMA v1.0-compatible, wireless power
receiver IC with advanced WPC v1.1.2 Foreign Object
Detection (FOD). The device operates with an AC power
signal from a resonant tank and converts it into a regulated
5V output voltage, which can be used to supply power to a
mobile application. It includes a high efficiency Synchronous
Full Bridge Rectifier and 5V tracking LDO output stage. The
P9028AC dual-mode operation automatically detects the
transmitter type and initiates either WPC or PMA AC
modulation communication protocols with optimal efficiency.
The device includes the control circuit required to modulate
the load to transmit WPC-compliant or PMA-compatible
message packets to the base station. It uses minimal
external components to reduce overall solution area.
The P9028AC employs advanced programmable WPC FOD
techniques to detect foreign metallic objects placed on the
transmitter base station derived from a transmitted and
received power transfer algorithm.
The P9028AC is available in a 36 ball 3mm X 3mm WLCSP
or 32 pin 5mm X 5mm TQFN package.
Typical Application Circuit
Packages: WLCSP-36 6x6 balls (3.06mm x 2.9mm) (See page 33)
TQFN-32 5x5mm (See page 35)
Ordering information: (See page 38)
Revision 1.0.3
1
© 2015 Integrated Device Technology, Inc.



IDT P9028AC
P9028AC
Product Datasheet
SIMPLIFIED APPLICATION DIAGRAM
Figure 1. Simplified Applications Schematic.
Revision 1.0.3
2 ©2015IntegratedDeviceTechnology,Inc.



IDT P9028AC
P9028AC
Product Datasheet
ABSOLUTE MAXIMUM RATINGS
These absolute maximum ratings are stress ratings only. Stresses greater than those listed below (Table 1 and Table 2) may cause permanent damage
to the device. Functional operation of the P9028AC at absolute maximum ratings is not implied. Application of the absolute maximum rating conditions
affects device reliability.
Table 1. Absolute Maximum Ratings Summary.
Description
Value
Units
AC1, AC2, VRECT, ACM1, ACM2, CLAMP1, CLAMP2
BST1, BST2
EN, STAT, SCL, SDA, OUT, SNS, TEOP, RLIM, CS100, FOD1, FOD2, VDD
PGND, PGND1, PGND2, AGND
Output Current OUT
Input Current AC1, AC2
-0.3 to 20
-0.3 to (AC1, AC2 + 6)
-0.3 to 6
-0.3 to 0.3
1.5
2
V
V
V
V
A
ARMS
Table 2. Package Thermal Information.1,2,3,4
Symbol Description
TQFN Rating WLCSP Rating
(7 thermal vias)
Units
JA Thermal Resistance Junction to Ambient
35 70 C/W
JC Thermal Resistance Junction to Case
29.6 0.9 C/W
JB Thermal Resistance Junction to Board
2.4 47.3 C/W
TJ Operating Junction Temperature
0 to +125
0 to +125
C
TA Operating Ambient Temperature
0 to +85
0 to +85
C
TSTG
Storage Temperature
-55 to +150
-55 to +150
C
TLEAD
Maximum Soldering Temperature (at Leads, 10s)
300 300 C
Note 1: The maximum power dissipation is PD(MAX) = (TJ(MAX) - TA) / θJA where TJ(MAX) is 125°C. Exceeding the maximum allowable power dissipation will
result in excessive die temperature, and the device will enter thermal shutdown.
Note 2: This thermal rating was calculated on JEDEC 51 standard 4-layer board with dimensions 3” x 4.5” in still air conditions.
Note 3: Actual thermal resistance is affected by PCB size, solder joint quality, layer count, copper thickness, air flow, altitude, and other unlisted variables.
Note 4: For the NBG32 package, connecting the 5 mm X 5 mm EP to internal/external ground planes with a 5x5 matrix of PCB plated-through-hole (PTH)
vias, from top to bottom sides of the PCB, is recommended for improving the overall thermal performance. For the WLCSP (AWG36) package, connecting
the 7 thermal balls to internal/external ground planes from top to bottom sides of the PCB, is recommended for improving the overall thermal performance.
Table 3. ESD Information.
Test
Model
Pins
HBM
CDM
All
All
Rating
±1500
±500
Units
V
V
Revision 1.0.3
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