300mA LDO
MITSUMI
300mA LDO with temperature sensor IC MM3615 Series
300mA LDO with temperature sensor IC
Monolithic IC MM3615 S...
Description
MITSUMI
300mA LDO with temperature sensor IC MM3615 Series
300mA LDO with temperature sensor IC
Monolithic IC MM3615 Series
SOT-25A
1. Flat-TV 2. BD Player/ Recorders 3. PCs 4. Games
MITSUMI
300mA LDO with temperature sensor IC MM3615 Series
MITSUMI
300mA LDO with temperature sensor IC MM3615 Series
MITSUMI
300mA LDO with temperature sensor IC MM3615 Series
MITSUMI
300mA LDO with temperature sensor IC MM3615 Series
MITSUMI
300mA LDO with temperature sensor IC MM3615 Series
MITSUMI
300mA LDO with temperature sensor IC MM3615 Series
About Power Dissipation
The Power dissipation change if board to mount IC change because radiative heat fix at board.It is reference data below, Evaluate IC in the set.
1. JEDEC51-7 standard
Board size
114.3mm×76.2mm t=1.6mm Copper foil area 80%
Power dissipation 560mW Ta=25°C (It is reference value measured by JEDEC51-7 standard.)
2. Spec. sheet condition
Board size
60mm×40mm t=1.6mm Copper foil area 60%
Power dissipation 280mW Ta=25°C
Condition of temperature and input voltage, output current should be used in enough margin concerning power dissipation. In consideration of product life, recommend to use in less than 80%.
It is recommended to layout the VIA for heat radiation in the GND pattern of reverse (of IC) when there is the GND pattern in the inner layer (in using multiplayer substrate). By increasing these copper foil pattern area of PCB, Power dissipation improves.
MITSUMI
300mA LDO with temperature sensor IC MM36...
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