Document
GigaDevice Semiconductor Inc. GD32F303xx
ARM® Cortex®-M4 32-bit MCU
Datasheet
GD32F303xx Datasheet Table of Contents
Table of Contents ........................................................................................................... 1 List of Figures ................................................................................................................ 4 List of Tables .................................................................................................................. 5 1. General description ................................................................................................. 7 2. Device overview ....................................................................................................... 8
2.1. Device information ....................................................................................................................... 8 2.2. Block diagram............................................................................................................................. 10 2.3. Pinouts and pin assignment ......................................................................................................11 2.4. Memory map ............................................................................................................................... 14 2.5. Clock tree .................................................................................................................................... 18 2.6. Pin definitions ............................................................................................................................. 19
2.6.1. GD32F303Zx LQFP144 pin definitions.................................................................. 19 2.6.2. GD32F303Vx LQFP100 pin definitions ................................................................. 28 2.6.3. GD32F303Rx LQFP64 pin definitions ................................................................... 34 2.6.4. GD32F303Cx LQFP48 pin definitions ................................................................... 38 3. Functional description .......................................................................................... 41
3.1. ARM® Cortex®-M4 core............................................................................................................... 41 3.2. On-chip memory ......................................................................................................................... 41 3.3. Clock, reset and supply management...................................................................................... 42 3.4. Boot modes ................................................................................................................................. 42 3.5. Power saving modes.................................................................................................................. 43 3.6. Analog to digital converter (ADC)............................................................................................. 43 3.7. Digital to analog converter (DAC)............................................................................................. 44 3.8. DMA ............................................................................................................................................. 44 3.9. General-purpose inputs/outputs (GPIOs) ................................................................................ 44 3.10. Timers and PWM generation ................................................................................................. 45 3.11. Real time clock (RTC)............................................................................................................. 46 3.12. Inter-integrated circuit (I2C) .................................................................................................. 46 3.13. Serial peripheral interface (SPI) ............................................................................................ 46 3.14. Universal synchronous asynchronous receiver transmitter (USART) ............................. 47
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3.15.
GD32F303xx Datasheet
Inter-IC sound (I2S) ................................................................................................................ 47
3.16. Universal serial bus full-speed device interface (USBD) ................................................... 47
3.17. Controller area network (CAN) .............................................................................................. 48
3.18. Secure digital input and output card interface (SDIO) ....................................................... 48
3.19. External memory controller (EXMC) ..................................................................................... 48
3.20. Debug mode ............................................................................................................................ 49
3.21. Package and operation temperature ..............................