Document
GigaDevice Semiconductor Inc. GD32F105xx
ARM® Cortex™-M3 32-bit MCU
Datasheet
GD32F105xx Datasheet
Table of Contents
Table of Contents ........................................................................................................... 1 List of Figures ................................................................................................................ 3 List of Tables .................................................................................................................. 4 1. General description ................................................................................................. 5 2. Device overview ....................................................................................................... 6
2.1. Device information ...................................................................................................... 6 2.2. Block diagram.............................................................................................................. 8 2.3. Pinouts and pin assignment ....................................................................................... 9 2.4. Memory map .............................................................................................................. 12 2.5. Clock tree ................................................................................................................... 16 2.6. Pin definitions............................................................................................................ 17
2.6.1. GD32F105Zx LQFP144 pin definitions................................................................................. 17 2.6.2. GD32F105Vx LQFP100 pin definitions ................................................................................ 26 2.6.3. GD32F105Rx LQFP64 pin definitions .................................................................................. 33
3. Functional description .......................................................................................... 38 3.1. ARM® Cortex™-M3 core ........................................................................................... 38 3.2. On-chip memory ........................................................................................................ 38 3.3. Clock, reset and supply management...................................................................... 39 3.4. Boot modes................................................................................................................ 39 3.5. Power saving modes ................................................................................................. 40 3.6. Analog to digital converter (ADC) ............................................................................ 40 3.7. Digital to analog converter (DAC)............................................................................. 41 3.8. DMA ............................................................................................................................ 41 3.9. General-purpose inputs/outputs (GPIOs) ................................................................ 41 3.10. Timers and PWM generation ................................................................................. 42 3.11. Real time clock (RTC) ............................................................................................ 43 3.12. Inter-integrated circuit (I2C) .................................................................................. 43 3.13. Serial peripheral interface (SPI) ............................................................................ 44 3.14. Universal synchronous asynchronous receiver transmitter (USART) ............... 44 3.15. Inter-IC sound (I2S) ................................................................................................ 44
1
GD32F105xx Datasheet
3.16. Universal serial bus full-speed (USBFS) .............................................................. 45 3.17. Controller area network (CAN) .............................................................................. 45 3.18. External memory controller (EXMC) ..................................................................... 45 3.19. Debug mode ........................................................................................................... 46 3.20. Package and operation temperature..................................................................... 46 4. Electrical characteristics....................................................................................... 47 4.1. Absolute maximum ratings ....................................................................................... 47 4.2. Recommended DC characteristics ........................................................................... 47 4.3. Power consumption .................................................................................................. 48 4.4. EMC characteristics ..........................................