Transmission Controller. BC7602 Datasheet

BC7602 Controller. Datasheet pdf. Equivalent

BC7602 Datasheet
Recommendation BC7602 Datasheet
Part BC7602
Description BLE Transparent Transmission Controller
Feature BC7602; BC7601/BC7602 BLE Transparent Transmission Controller Features • 3.3V operating voltage • Integra.
Manufacture Holtek Semiconductor
Datasheet
Download BC7602 Datasheet




Holtek Semiconductor BC7602
BC7601/BC7602
BLE Transparent Transmission Controller
Features
• 3.3V operating voltage
Integrated high performance RF and MODEM for
enhanced BLE.
• Few external components required as well as on-chip
32 MHz crystal capacitors to reduce the BOM cost.
Integrated DC/DC converter and LDOs allowing a
wider supply range with a single power supply
• Over 75dB RX of gain in programmable gain steps
• Integrated SPI and UART for ACI interfaces
• Includes Sleep and Power Down modes for low
power consumption
• Embedded patch memory to reduce system
development effort and cost BC7602 only
• Package types:
BC7601: 32-pin QFN – 4mmx4mm
BC7602: 46-pin QFN – 6.5mmx4.5mm
Applications
• Health care products
• Smart home appliances
• Beacons
General Description
The BC7601/BC7602 devices are fully-integrated,
single-chip Bluetooth Low Energy, BLE, controllers.
The devices are specially designed to act as BLE
slave controllers in accordance with the Bluetooth
specification v4.1.
The devices can be controlled by any external
microcontroller through the Application Controller
Interface, ACI, which is designed to allow the devices
to easily communicate with external circuitry. The
UART and SPI interfaces are available as the ACI
transport layers.
Additionally, during intervals where there is no active
BLE RF connection, the devices will enter a Sleep
Mode thus further reducing power consumption.
In general practice, the BC7601/BC7602 devices
will be required to download a patch code for full
BLE optimisation. For convenience and system cost
reduction, the BC7602 device already supports an
internal patch code and so does not need to patch
from the external microcontroller.
BC7602 Order Information
Part Number
Patch Code Version
BC7602-BC1
V1.1
Block Diagram
VDDIF_15
VDDRF_15
VDDLO_15
RST_N PDN
RFIO
XI
XO
Balun
PA VCO
Switch
LNA
Frequency
Synthesizer
Mixer
+Gain
IF Filter
& Demod
BLE
Controller
Xtal
OSC
DC/DC
Converter
LDO
EEPROM
(BC7602 Only)
ACI
INT_EXT
WAKEUP
STATE
SPI_INT
SPI_CS/UR_CTS
SPI_CLK/UR_RTS
SPI_MOSI/UR_RXD
SPI_MISO/UR_TXD
SPI-UR_N
EE_WP
IIC_CLK
IIC_SDA
PVIN DCDC_SW VOUT_15 DVDD_12 SCL SDA WP A[2:0]
Expose Pad : RFGND
Rev. 1.20
1 December 15, 2017



Holtek Semiconductor BC7602
Pin Assignment
BC7601/BC7602
DFT
SPI_CS/UR_CTS
SPI_CLK/UR_RTS
SPI_MOSI/UR_RXD
SPI_MISO/UR_TXD
NC
PDN
PVIN
1 32 31 30 29 28 27 26 2524
2 23
3 22
4
BC7601
21
5
32 QFN-A
20
6 19
7 18
8 17
9 10 11 12 13 14 15 16
RFGND
RFIO
VDDRF_15
VDDIF_15
RFGND
IIC_CLK
NC
RST_N
RFGND
VDD
NC
NC
NC
NC
A0
A1
A2
VSS
14645
44
4342
414039
38 37
3635
34
33
32
2 31
3 30
4
5
6
BC7602
46 QFN-A
29
28
27
7 26
8 25
9 24
10111213 1415 16171819 20212223
IIC_CLK
EE_WP
IIC_SDA
DVDD_12
XO
XI
VDDLO_15
DC_TEST
VDDRF_15
RFGND
Rev. 1.20
2 December 15, 2017



Holtek Semiconductor BC7602
BC7601/BC7602
Pin Description
BC7601
Name
DFT
SPI_CS/UR_CTS
SPI_CLK/UR_RTS
SPI_MOSI/UR_RXD
SPI_MISO/UR_TXD
NC
PDN
PVIN
NC
DCDC_SW
VOUT_15
SPI_INT
SPI-UR_N
WAKEUP
INT_EXT
STATE
RST_N
NC
IIC_CLK
RFGND
VDDIF_15
VDDRF_15
RFIO
RFGND
DC_TEST
VDDLO_15
XI
XO
DVDD_12
NC
IIC_SDA
EE_WP
RFGND
No Type
Description
1 DI For normal operation connect to RFGND.
2 DI SPI CS or UART CTS; selected by SPI-UR_N during the power-on period
3 DI SPI CLK or UART RTS; selected by SPI-UR_N during the power-on period
4 DI SPI MOSI or UART RXD; selected by SPI-UR_N during the power-on period
5 DO SPI MISO or UART TXD; selected by SPI-UR_N during the power-on period
6 — No Connection – connect to RFGND
7
DI
Power down control pin
When low the device enters the Power down mode
8 P Power-supply; 2.2V~3.6V
9 — No Connection – connect to RFGND
10 P Switching Output – connect to the switching end of the inductor
11 P 1.5V power output
12 DO SPI interrupt request when SPI mode is selected
SPI/UART mode select pin during the power-on period
13 DI 1: SPI pins selected
0: UART pins selected
14
DI
Wake-up pin
Enters the Sleep Mode when low
15 DO External Interrupt
IC state pin indicator
16 DO 1: Operating mode
0: Sleep mode
17 DI Hardware reset, active low
18 — No Connection – connect to RFGND
Connect to external host or EEPROM SCL pin.
19 DIO IIC_CLK pin is baud rate selection when UART mode is selected. Where
0: 9600bps, 1: 115200bps.
20 P RF Power Ground
21 P Analog power for IF section – connect to VOUT_15
22 P Analog power for RF section – connect to VOUT_15
23 AIO RF input or output
24 P RF Power Ground
25 AO RF function test pin
26 P Analog power for RF section, connect to VOUT_15
27 AI Crystal oscillator input
28 AO Crystal oscillator output
29 P 1.2V internal digital power – connect 0.1μF capacitor to RFGND
30 — No Connection – connect to RFGND
31 DIO Connect to external host or EEPROM SDA pin
32 DO Connect to external host or EEPROM WP pin
Exposed Pad on package lower side. Internally connected to RFGND. Solder
EP
P
this exposed pad to a PCB pad that uses multiple ground vias to provide heat
transfer out of the device into the PCB ground planes. These multiple ground
vias are also required to achieve the noted RF performance.
Legend: AI=Analog Input; AO=Analog Output; AIO=Analog In/out;
DI=Digital Input; DO=Digital Output; DIO=Digital In/Out; P=Power
Rev. 1.20
3 December 15, 2017







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