Transmission Module. BCM-7602-G01 Datasheet

BCM-7602-G01 Module. Datasheet pdf. Equivalent

BCM-7602-G01 Datasheet
Recommendation BCM-7602-G01 Datasheet
Part BCM-7602-G01
Description BLE Transparent Transmission Module
Feature BCM-7602-G01; BCM-7602-G01 BLE Transparent Transmission Module Features • Operating voltage: 2.2V~3.6V • Operat.
Manufacture Holtek Semiconductor
Datasheet
Download BCM-7602-G01 Datasheet




Holtek Semiconductor BCM-7602-G01
BCM-7602-G01
BLE Transparent Transmission Module
Features
• Operating voltage: 2.2V~3.6V
• Operating current:
Power down mode: 500nA
Sleep mode: 20μA
Broadcast mode: 180μA @ 250ms
Transparent transmission: 1.1mA @ 20 bytes,
5 times/sec.
• Frequency range: 2402MHz~2480MHz
• TX output power: +3dBm @ Max. power setting
• RX sensitivity: -90dBm (Typ.) @ 1M BPS
• Modulation: GFSK
• Transmission distance: 60m in open area
• Interface: 8 pins × 2 – pitch = 1.27mm stamp hole
• Dimensions: 16mm(L) × 16mm(W)
• Temperature range: -20°C ~ +85°C
General Description
The BCM-7602-G01 is a Bluetooth Low Energy,
BLE, transparent transceiver module which is a design
based on the BC7602 BLE transparent transmission
device. More detailed information is described in
the BC7602 datasheets. This module can wirelessly
control external devices and supports bidirectional
data transfer suitable for lighting products, health care
products and home appliances.
Ordering Information
Part Number
Patch Code Version
BCM-7602-G01-BC1
V1.1
Interface
Pin No.
1
2
Pin Name
GND
RST_N
3 STATE
4 INT_EXT
5 WAKEUP
6 SPI-UR_N
7 SDA
8 SCL
9 VDD
10 PDN
11 WP
12 SPI_MISO/UR_TXD
13 SPI_MOSI/UR_RXD
14 SPI_CLK/UR_RTS
15 SPI_CS/UR_CTS
16 GND
Type
P
DI
DO
DO
DI
DI
DIO
DI
P
DI
DI
DO
DI
DI
DI
P
Function Description
RF negative power supply, ground
Hardware reset input, active low
BC7602 state pin indicator
0: Operating mode
1: Sleep mode
External Interrupt, normally high and active low
Wake-up pin
Enters the Sleep Mode when low
SPI/UART mode select pin – selected during the power-on period
0: UART pins selected
1: SPI pins selected
EEPROM SDA
EEPROM SCL
RF positive power supply, 2.2V~3.6V
Power down control pin
Enters the power down mode when low
EEPROM WP
SPI MISO or UART TXD pin
Selected by SPI-UR_N during the power-on period
SPI MOSI or UART RXD pin
Selected by SPI-UR_N during the power-on period
SPI CLK or UART RTS pin
Selected by SPI-UR_N during the power-on period
SPI CS or UART CTS pin
Selected by SPI-UR_N during the power-on period
RF negative power supply, ground.
Legend: DI=Digital Input; DO=Digital Output; DIO=Digital In/Out; P=Power.
Rev. 1.00
1 December 15, 2017



Holtek Semiconductor BCM-7602-G01
Module Dimension Drawing
BCM-7602-G01
Module Photograph
Top View
PCB Antenna
32MHz Crystal
GND
RST_N
STATE
INT_EXT
WAKEUP
SPI-UR_N
Stamp holes
Dimension: 16 mm × 16 mm
Double Layer PCB
BC7602
GND
SPI_CS / UR_CTS
SPI_CLK / UR_RTS
SPI_MOSI / UR_RXD
SPI_MISO / UR_TXD
WP
PDN
VDD
 
Rev. 1.00
2 December 15, 2017



Holtek Semiconductor BCM-7602-G01
BCM-7602-G01
Bill of Material
Item
1
2
3
4
5
6
7
8
9
14
15
16
20
21
22
23
24
25
Comp.
Description
C1 X5R ceramic capacitor
C2 X5R ceramic capacitor
C3 X5R ceramic capacitor
C4 X5R ceramic capacitor
C5 C0G ceramic capacitor
C6 X5R ceramic capacitor
C7 X5R ceramic capacitor
C8 C0G ceramic capacitor
C9 X5R ceramic capacitor
R1 Chip resistor
R2 Chip resistor
R3 Chip resistor
L1 Chip Beads
L2 Chip Beads
L3 Chip inductor
Size
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
0402
Value
1μF
1μF
2.2μF
1μF
3.3pF
1μF
1μF
2.4pF
1μF
47K
47K
47K
4.7nH
L4 Multi-layer Power Inductor 0603
2.2μH
U1 IC
Y1 Crystal
QFN46
BC7602
SMD3225 32MHZ/12pF
Tol. Part Number
±10%
±10%
±10%
±10%
±5%
±10%
±10%
±5%
±10%
±5%
±5%
±5%
— MURATA: BLM15PD121SN1
— MURATA: BLM15PD121SN1
±2% MURATA: LQG15HN4N7S02
±5%
MURATA: LQM18PN2R2NC0
TDK: MLZ1608N2R2LT000
Sunlord: MCL2012S2R2MT
——
±20ppm
KDS: 1N232000AA0N
YOKE: S3225A-032000-F12
Rev. 1.00
3 December 15, 2017







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