Document
BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
Rev. 8 — 18 October 2011
Product data sheet
1. Product profile
1.1 General description
NPN medium power transistor series in Surface-Mounted Device (SMD) plastic packages.
Table 1. Product overview
Type number[1]
Package
NXP
BCP68
SOT223
BC868
SOT89
BC68PA
SOT1061
JEITA SC-73 SC-62 -
JEDEC TO-243 -
PNP complement
BCP69 BC869 BC69PA
[1] Valid for all available selection groups.
1.2 Features and benefits
High current Two current gain selections High power dissipation capability Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061) Leadless very small SMD plastic package with medium power capability (SOT1061) AEC-Q101 qualified
1.3 Applications
Linear voltage regulators Low-side switches Battery-driven devices
Power management MOSFET drivers Amplifiers
1.4 Quick reference data
Table 2. Symbol VCEO IC ICM
Quick reference data
Parameter
Conditions
collector-emitter voltage open base
collector current
peak collector current single pulse; tp 1 ms
Min Typ Max Unit - - 20 V - - 2A - - 3A
NXP Semiconductors
BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
Table 2. Quick reference data …continued
Symbol Parameter
Conditions
Min Typ Max Unit
hFE DC current gain
VCE = 1 V; IC = 500 mA [1] 85
-
375
hFE selection -25
VCE = 1 V; IC = 500 mA [1] 160 -
375
[1] Pulse test: tp 300 s; = 0.02.
2. Pinning information
Table 3. Pin SOT223 1 2 3 4
Pinning Description
base collector emitter collector
SOT89 1 2 3
emitter collector base
Simplified outline Graphic symbol
4 123
2, 4
1 3
sym016
321
2
3
1 sym042
SOT1061 1 2 3
base emitter collector
3
12 Transparent top view
3
1 2
sym021
BCP68_BC868_BC68PA
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 18 October 2011
© NXP B.V. 2011. All rights reserved.
2 of 23
NXP Semiconductors
BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
3. Ordering information
4. Marking
Table 4. Ordering information
Type number[1] Package
Name Description
BCP68
SC-73
plastic surface-mounted package with increased heatsink; 4 leads
BC868
SC-62
plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads
BC68PA
HUSON3 plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 2 0.65 mm
[1] Valid for all available selection groups.
Version SOT223
SOT89
SOT1061
Table 5. Marking codes Type number BCP68 BCP68-25 BC868 BC868-25 BC68PA BC68-25PA
Marking code BCP68 BCP68/25 CAC CDC AR AS
BCP68_BC868_BC68PA
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 18 October 2011
© NXP B.V. 2011. All rights reserved.
3 of 23
NXP Semiconductors
BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
5. Limiting values
Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
VCBO VCEO VEBO IC ICM
IB IBM
Ptot
collector-base voltage collector-emitter voltage emitter-base voltage collector current peak collector current
base current peak base current
total power dissipation BCP68
open emitter open base open collector
single pulse; tp 1 ms
single pulse; tp 1 ms Tamb 25 C
-
-
[1] -
[2] -
[3] -
BC868
[1] -
[2] -
[3] -
BC68PA
[1] -
[2] -
[3] -
[4] -
[5] -
Tj Tamb Tstg
junction temperature ambient temperature storage temperature
55 65
Max Unit 32 V 20 V 5V 2A 3A
0.4 A 0.4 A
0.65 1.00 1.35 0.50 0.95 1.35 0.42 0.83 1.10 0.81 1.65 150 +150 +150
W W W W W W W W W W W C C C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.
[4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm2.
BCP68_BC868_BC68PA
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 8 — 18 October 2011
© NXP B.V. 2011. All rights reserved.
4 of 23
NXP Semiconductors
BCP68; BC868; BC68PA
20 V, 2 A NPN medium power transistors
1.5 Ptot (W)
1.0
0.5
(1) (2) (3)
006aac674
1.5
Ptot (W)
1.0
(1) (2)
(3)
0.5
006aac675
0.0 –75
–25
25
75 125 175 Tamb (°C)
(1) FR4 PCB, mounting pad for collector 6 cm2 (2) FR4 PCB, mounting pad for collector 1 cm2 (3) FR4 PCB, standard footprint
Fig 1. Power derating curves SOT223
2.0
Ptot (W)
1.5
(1)
(2)
1.0
(3) (4)
0.5 (5)
0.0 –75
–25
25
75 125 175 Tamb (°C)
(1) FR4 PCB, mounting pad for collector 6 cm2 (2) FR4 PCB, mounting pad for collector 1 cm2 (3) FR4 PCB, standard footprint
Fig 2. Power derating curves SOT.