Document
BCP52; BCX52; BC52PA
60 V, 1 A PNP medium power transistors
Rev. 9 — 18 October 2011
Product data sheet
1. Product profile
1.1 General description
PNP medium power transistor series in Surface-Mounted Device (SMD) plastic packages.
Table 1. Product overview
Type number[1]
Package
NXP
BCP52
SOT223
BCX52
SOT89
BC52PA
SOT1061
JEITA SC-73 SC-62 -
[1] Valid for all available selection groups.
JEDEC TO-243 -
NPN complement
BCP55 BCX55 BC55PA
1.2 Features and benefits
High current Three current gain selections High power dissipation capability Exposed heatsink for excellent thermal and electrical conductivity (SOT89, SOT1061) Leadless very small SMD plastic package with medium power capability (SOT1061) AEC-Q101 qualified
1.3 Applications
Linear voltage regulators High-side switches Battery-driven devices Power management MOSFET drivers Amplifiers
1.4 Quick reference data
Table 2. Symbol VCEO IC ICM
Quick reference data
Parameter
Conditions
collector-emitter voltage open base
collector current
peak collector current single pulse; tp 1 ms
Min Typ Max Unit - - 60 V - - 1 A - - 2 A
NXP Semiconductors
BCP52; BCX52; BC52PA
60 V, 1 A PNP medium power transistors
Table 2. Symbol hFE
Quick reference data …continued
Parameter
Conditions
DC current gain hFE selection -10 hFE selection -16
VCE = 2 V; IC = 150 mA
VCE = 2 V; IC = 150 mA
VCE = 2 V; IC = 150 mA
Min Typ Max Unit
63 -
250
63 -
160
100 -
250
2. Pinning information
Table 3. Pin SOT223 1 2 3 4
Pinning Description
base collector emitter collector
SOT89 1 2 3
emitter collector base
SOT1061 1 2 3
base emitter collector
Simplified outline Graphic symbol
4 123
2, 4
1 3
sym028
321
2
3
1 006aaa231
3
12 Transparent top view
3
1 2
sym013
BCP52_BCX52_BC52PA
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 18 October 2011
© NXP B.V. 2011. All rights reserved.
2 of 22
NXP Semiconductors
BCP52; BCX52; BC52PA
60 V, 1 A PNP medium power transistors
3. Ordering information
4. Marking
Table 4. Ordering information
Type number[1] Package
Name Description
BCP52
SC-73
plastic surface-mounted package with increased heatsink; 4 leads
BCX52
SC-62
plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads
BC52PA
HUSON3 plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body 2 2 0.65 mm
[1] Valid for all available selection groups.
Version SOT223
SOT89
SOT1061
Table 5. Marking codes Type number BCP52 BCP52-10 BCP52-16 BCX52 BCX52-10 BCX52-16 BC52PA BC52-10PA BC52-16PA
Marking code BCP52 BCP52/10 BCP52/16 AE AG AM BS BT BU
BCP52_BCX52_BC52PA
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 18 October 2011
© NXP B.V. 2011. All rights reserved.
3 of 22
NXP Semiconductors
BCP52; BCX52; BC52PA
60 V, 1 A PNP medium power transistors
5. Limiting values
Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
VCBO VCEO VEBO IC ICM
IB IBM
Ptot
collector-base voltage collector-emitter voltage emitter-base voltage collector current peak collector current
base current peak base current
total power dissipation BCP52
open emitter open base open collector
single pulse; tp 1 ms
single pulse; tp 1 ms Tamb 25 C
-
-
[1] -
[2] -
[3] -
BCX52
[1] -
[2] -
[3] -
BC52PA
[1] -
[2] -
[3] -
[4] -
[5] -
Tj Tamb Tstg
junction temperature ambient temperature storage temperature
55 65
Max Unit 60 V 60 V 5 V 1 A 2 A
0.3 A 0.3 A
0.65 1.00 1.35 0.50 0.95 1.35 0.42 0.83 1.10 0.81 1.65 150 +150 +150
W W W W W W W W W W W C C C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. [3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.
[4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. [5] Device mounted on an FR4 PCB, 4-layer copper, tin-plated, mounting pad for collector 1 cm2.
BCP52_BCX52_BC52PA
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 9 — 18 October 2011
© NXP B.V. 2011. All rights reserved.
4 of 22
NXP Semiconductors
BCP52; BCX52; BC52PA
60 V, 1 A PNP medium power transistors
1.5 Ptot (W)
1.0
0.5
(1) (2) (3)
006aac674
1.5
Ptot (W)
1.0
(1) (2)
(3)
0.5
006aac675
0.0 –75
–25
25
75 125 175 Tamb (°C)
(1) FR4 PCB, mounting pad for collector 6 cm2 (2) FR4 PCB, mounting pad for collector 1 cm2 (3) FR4 PCB, standard footprint
Fig 1. Power derating curves SOT223
2.0 Ptot (W)
1.5
1.0
0.5
(1)
(2) (3) (4) (5)
0.0 –75
–25
25
75 125 175 Tamb (°C)
(1) FR4 PCB, mounting pad for collector 6 cm2 (2) FR4 PCB, mounting pad for collector .