Document
GLZ2.0 SERIES
SURFACE MOUNT ZENER DIODES
VOLTAGE 2.0 to 56 Volt
POWER 500 mWatt
FEATURES
• Planar Die construction • 500mW Power Dissipation • Ideally Suited for Automated Assembly Processes • Lead free in compliance with EU RoHS 2011/65/EU directive
MECHANICAL DATA
• Case: Molded Glass MINI-MELF • Terminals: Solderable per MIL-STD-750, Method 2026 • Approx. Weight: 0.001 ounces, 0.03 grams. • Polarity : Color band denotes cathode end • Packing information
T/R - 2.5K per 7" plastic Reel T/R - 10K per 13" plastic Reel
0.020(0.5) 0.012(0.3)
0.146(3.7) 0.130(3.3)
0.020(0.5) 0.012(0.3)
0.063(1.6) 0.055(1.4)DIA.
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Parameter Power Dissipation at TA= 25OC
Symbol PTOT
Junction Temperature Range
TJ
Storage Temperature Range
TSTG
Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.
Value 500 -55 to + 175 -65 to + 175
Units mW OC OC
Parameter Thermal Resistance Junction to Ambi.