MOSFET Optocoupler. HSSR-7112 Datasheet

HSSR-7112 Optocoupler. Datasheet pdf. Equivalent

HSSR-7112 Datasheet
Recommendation HSSR-7112 Datasheet
Part HSSR-7112
Description Power MOSFET Optocoupler
Feature HSSR-7112; HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E, 5962-9314001, 5962-93140021 90V/1.0Ω, Hermetically Seale.
Manufacture Broadcom
Datasheet
Download HSSR-7112 Datasheet




Broadcom HSSR-7112
HSSR-7110, HSSR-7111, HSSR-7112,
HSSR-711E, 5962-9314001, 5962-93140021
90V/1.0Ω, Hermetically Sealed, Power MOSFET
Optocoupler
Data Sheet
Description
The Broadcom® HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E
and SMD 5962-9314001, 5962-9314002 are single-channel
power MOSFET optocouplers, constructed in eight-pin,
hermetic, dual-in-line, ceramic packages. The devices operate
exactly like a solid-state relay.
The products are capable of operation and storage over the full
military temperature range and can be purchased as a
commercial product (HSSR-7110), with full MIL-PRF-38534
Class H testing (HSSR-7111 and HSSR- 7112), with
MIL-PRF-38534 Class E testing (Class K with exceptions)
(HSSR-711E) or from the DLA Standard Microcircuit Drawing
(SMD) 5962-93140. Details of the Class E program exceptions
are listed here:
1. Nondestructive Bond Pull, Test method 2023 of
MIL-STD-883 in device screening is not required.
2. Particle Impact Noise Detection (PIND), Test method 2020
of MIL-STD-883 in device screening and group C testing is
not required.
3. Die Shear Strength, Test method 2019 of MIL-STD-883 in
group B testing is not required.
4. Internal Water Vapor Content, Test method 1018 of
MIL-STD-883 in group C testing is not required.
5. Scanning Electron Microscope (SEM) inspections, Test
method 2018 of MIL-STD-883 in element evaluation is not
required.
Features
Dual marked with device part number and DLA Standard
Microcircuit Drawing (SMD)
ac/dc signal and power switching
Compact solid-state bidirectional switch
Manufactured and tested on a MIL-PRF-38534 certified line
QML-38534, Class H and Class E
Hermetically sealed 8-pin, dual-in-line package
Small size and weight
Performance guaranteed over –55°C to +125°C
Connection A 0.8A, 1.0Ω
Connection B 1.6A, 0.25Ω
1500 Vdc withstand test voltage
High transient immunity
5 Amp output surge current
Applications
Military and space
High reliability systems
Standard 28 Vdc and 48 Vdc load driver
Standard 24 Vac load driver
Aircraft controls
ac/dc electromechanical and solid-state relay replacement
I/O modules
Harsh industrial environments
CAUTION
1. See Selection Guide – Lead Configuration Options for available
extensions.
Broadcom
-1-
It is advised that normal static precautions be
taken in handling and assembly of this
component to prevent damage and/or
degradation that may be induced by ESD.



Broadcom HSSR-7112
HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E, 5962-9314001, 5962-9314002
Data Sheet
Functional Diagrams
Functional Diagrams
CONNECTION A
AC/DC CONNECTION
1 NC
IF
+2
VF
-3
8
7
6
IO
+
VO
4 NC
5-
CONNECTION B
DC CONNECTION
1 NC
IF
+2
VF
-3
8
7
6
4 NC
5
IO
+
VO
-
TRUTH TABLE
INPUT OUTPUT
H CLOSED
L OPEN
All devices are manufactured and tested on a MIL-PRF-38534
certified line, and Class H and Class E devices are included in
the DLA Qualified Manufacturers List, QML-38534 for Hybrid
Microcircuits. Each device contains an AlGaAs light-emitting
diode optically coupled to a photovoltaic diode stack, which
drives two discrete power MOSFETs. The device operates as a
solid-state replacement for single-pole, normally open (1 Form
A) relay used for general-purpose switching of signals and
loads in high reliability applications.
The devices feature logic level input control and very low
output on-resistance, making them suitable for both ac and dc
loads. Connection A, as shown in the Functional Diagrams,
allows the device to switch either ac or dc loads. Connection B,
with the polarity and pin configuration as shown, allows the
device to switch dc loads only. The advantage of Connection B
is that the on-resistance is significantly reduced, and the
output current capability increases by a factor of two.
The devices are convenient replacements for mechanical and
solid-state relays where high component reliability with
standard footprint lead configuration is desirable. Devices may
be purchased with a variety of lead bend and plating options.
See Selection Guide – Lead Configuration Options table for
details. Standard microcircuit drawing (SMD) parts are available
for each package and lead style.
The HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E, and SMD
5962-9314001, 5962-9314002 are designed to switch loads on
28 Vdc power systems. They meet 80V surge and ±600V spike
requirements.
CAUTION
Maximum Switching Frequency – Care should be
taken during repetitive switching of loads so as
not to exceed the maximum output current,
maximum output power dissipation, maximum
case temperature, and maximum junction
temperature.
Selection Guide – Lead Configuration Options
Avago Technologies Part Number and Options
Commercial
HSSR-7110
MIL-PRF-38534 Class H
HSSR-7111
MIL-PRF-38534 Class E
Standard Lead Finisha
Gold Plate
Solder Dippedb
Option #200
Butt Joint/Gold Platea
Option #100
Gull Wing/Solderedb
Option #300
Crew Cut/Gold Platea
Option #600
SMD Part Number
Prescript for all below
5962-
Gold Platea
9314001HPC
Solder Dippedb
9314001HPA
Butt Joint/Gold Platea
9314001HYC
Butt Joint/Solderedb
9314001HYA
Gull Wing/Solderedb
9314001HXA
Crew Cut/Gold Platea
9314001HZC
Crew Cut/Solderedb
9314001HZA
HSSR-7112
Gold Plate
Option -200
Option -100
Option -300
Option -600
5962-
9314002HPC
9314002HPA
9314002HYC
9314002HYA
9314002HXA
9314002HZC
9314002HZA
a. Gold Plate lead finish: Maximum gold thickness of leads is <100 μin. Typical is 60 μin to 90 μin.
b. Solder lead finish: Sn63/Pb37.
Broadcom
-2-
HSSR-711E
Gold Plate
Option -200
Option -300
5962-
9314001EPC
9314001EPA
9314001EXA



Broadcom HSSR-7112
HSSR-7110, HSSR-7111, HSSR-7112, HSSR-711E, 5962-9314001, 5962-9314002
Data Sheet
Outline Drawing
Outline Drawing
8-Pin DIP Through Hole
0.51 (0.020)
MIN.
10.03 (0.395)
10.29 (0.405)
1.02 (0.040)
1.52 (0.060)
4.32 (0.170 )
MAX.
3.81 (0.150 )
MIN.
8.13 (0.320)
MAX.
7.16 (0.282 )
7.57 (0.298 )
0.20 (0.008 )
0.33 (0.013 )
2.29 (0.090)
2.79 (0.110)
0.51 (0.020 )
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
7.36 (0.290)
7.87 (0.310)
Hermetic Optocoupler Options
Note: Dimensions in millimeters (inches).
Device Marking
AVAGO
DESIGNATOR
AVAGO P/N
DLA SMD[1]
DLA SMD[1]
PIN ONE/
ESD IDENT
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
50434
[1] QML PARTS ONLY
COMPLIANCE INDICATOR,[1]
DATE CODE, SUFFIX
(IF NEEDED)
COUNTRY OF MFR.
AVAGO CAGE CODE[1]
Thermal Resistance
Maximum Output MOSFET Junction to Case – θJC = 15°C/W
ESD Classification
MIL-STD-883, Method 3015
, Class 2
Option
100
Description
Surface-mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on Commercial,
Class H and E product.
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
200 Lead finish is solder dipped rather than gold plated. This option is available on Commercial, Class H and E product. DLA Drawing
(SMD) part numbers contain provisions for lead finish.
300 Surface-mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is available on Commercial,
Class H and E product. This option has solder dipped leads.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
4.57 (0.180)
MAX.
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
5˚ MAX.
0.20 (0.008)
0.33 (0.013)
9.65 (0.380)
9.91 (0.390)
4.57 (0.180)
MAX.
1.07 (0.042)
1.31 (0.052)
600 Surface-mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on Commercial,
Class H and E product.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
3.81 (0.150)
MAX.
1.02 (0.040)
TYP.
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
Broadcom
-3-







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