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MIMX8MQ7DVAJZAA Dataheets PDF



Part Number MIMX8MQ7DVAJZAA
Manufacturers NXP
Logo NXP
Description i.MX 8M Dual / 8M QuadLite / 8M Quad Applications Processors
Datasheet MIMX8MQ7DVAJZAA DatasheetMIMX8MQ7DVAJZAA Datasheet (PDF)

NXP Semiconductors Data Sheet: Technical Data Document Number: IMX8MDQLQCEC Rev. 3, 04/2021 MIMX8MQ6DVAJZAA MIMX8MQ5DVAJZAA MIMX8MQ6DVAJZIB MIMX8MD6DVAJZAB MIMX8MQ6DVAJZAB MIMX8MQ5DVAJZAB MIMX8MD6DVAJZAA i.MX 8M Dual / 8M QuadLite / 8M Quad Applications Processors Data Sheet for Consumer Products Package Information Bare Die Package FBGA 17 x 17 mm, 0.65 mm pitch Ordering Information See Table 2 on page 6 1 i.MX 8M Dual / 8M QuadLite / 8M Quad introduction The i.MX 8M Dual / 8M QuadLite /.

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NXP Semiconductors Data Sheet: Technical Data Document Number: IMX8MDQLQCEC Rev. 3, 04/2021 MIMX8MQ6DVAJZAA MIMX8MQ5DVAJZAA MIMX8MQ6DVAJZIB MIMX8MD6DVAJZAB MIMX8MQ6DVAJZAB MIMX8MQ5DVAJZAB MIMX8MD6DVAJZAA i.MX 8M Dual / 8M QuadLite / 8M Quad Applications Processors Data Sheet for Consumer Products Package Information Bare Die Package FBGA 17 x 17 mm, 0.65 mm pitch Ordering Information See Table 2 on page 6 1 i.MX 8M Dual / 8M QuadLite / 8M Quad introduction The i.MX 8M Dual / 8M QuadLite / 8M Quad processors 1. i.MX 8M Dual / 8M QuadLite / 8M Quad introduction . . . 1 represent NXP’s latest market of connected streaming 1.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 audio/video devices, scanning/imaging devices, and 2. 1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 6 Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 various devices requiring high-performance, low-power 2.1. Recommended connections for unused interfaces 12 processors. 3. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 13 3.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 13 The i.MX 8M Dual / 8M QuadLite / 8M Quad processors feature advanced implementation of a quad Arm® 3.2. Power supplies requirements and restrictions . . . 27 3.3. PLL electrical characteristics . . . . . . . . . . . . . . . . 29 3.4. On-chip oscillators . . . . . . . . . . . . . . . . . . . . . . . . 30 Cortex®-A53 core, which operates at speeds of up to 3.5. I/O DC parameters . . . . . . . . . . . . . . . . . . . . . . . 32 1.5 GHz. A general purpose Cortex®-M4 core processor 3.6. I/O AC parameters . . . . . . . . . . . . . . . . . . . . . . . 34 3.7. Output buffer impedance parameters . . . . . . . . . 37 is for low-power processing. The DRAM controller 3.8. System modules timing . . . . . . . . . . . . . . . . . . . . 39 supports 32-bit/16-bit LPDDR4, DDR4, and DDR3L 4. 3.9. External peripheral interface parameters . . . . . . 40 Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 76 memory. There are a number of other interfaces for 4.1. Boot mode configuration pins . . . . . . . . . . . . . . . 76 connecting peripherals, such as WLAN, Bluetooth, GPS, 4.2. Boot device interface allocation . . . . . . . . . . . . . . 77 displays, and camera sensors. The i.MX 8M Quad and 5. Package information and contact assignments . . . . . . . 78 5.1. 17 x 17 mm package information . . . . . . . . . . . . 78 i.MX 8M Dual processors have hardware acceleration 5.2. DDR pin function list for 17 x 17 mm package . . 98 for video playback up to 4K, and can drive the video 6. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101 outputs up to 60 fps. Although the i.MX 8M QuadLite processor does not have hardware acceleration for video decode, it allows for video playback with software decoders if needed. NXP re.


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