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K4S561632E-UC75 Dataheets PDF



Part Number K4S561632E-UC75
Manufacturers Samsung
Logo Samsung
Description SDRAM 256Mb E-die
Datasheet K4S561632E-UC75 DatasheetK4S561632E-UC75 Datasheet (PDF)

SDRAM 256Mb E-die (x4, x8, x16) CMOS SDRAM 256Mb E-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) Revision 1.3 August 2004 * Samsung Electronics reserves the right to change products or specification without notice. Rev. 1.3 August 2004 SDRAM 256Mb E-die (x4, x8, x16) Revision History Revision 1.0 (May. 2003) - First generation for Pb_free products Revision 1.1 (August. 2003) - Corrected typo in Page #8, 9 Revision 1.2 (May. 2004) - Added Note 5. sentense of tRDL parameter .

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SDRAM 256Mb E-die (x4, x8, x16) CMOS SDRAM 256Mb E-die SDRAM Specification 54 TSOP-II with Pb-Free (RoHS compliant) Revision 1.3 August 2004 * Samsung Electronics reserves the right to change products or specification without notice. Rev. 1.3 August 2004 SDRAM 256Mb E-die (x4, x8, x16) Revision History Revision 1.0 (May. 2003) - First generation for Pb_free products Revision 1.1 (August. 2003) - Corrected typo in Page #8, 9 Revision 1.2 (May. 2004) - Added Note 5. sentense of tRDL parameter Revision 1.3 (August. 2004) - Corrected typo. CMOS SDRAM Rev. 1.3 August 2004 SDRAM 256Mb E-die (x4, x8, x16) CMOS SDRAM 16M x 4Bit x 4 Banks / 8M x 8Bit x 4 Banks / 4M x 16Bit x 4 Banks SDRAM FEATURES • JEDEC standard 3.3V power supply • LVTTL compatible with multiplexed address • Four banks operation • MRS cycle with address key programs -. CAS latency (2 & 3) -. Burst length (1, 2, 4, 8 & Full page) -. Burst type (Sequential & Interleave) • All inputs are sampled at the positi.


K4S561632E-UC60 K4S561632E-UC75 MT29F2G08ABAGAWP-ITG


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