3-Axis Accelerometer. MC3416 Datasheet

MC3416 Accelerometer. Datasheet pdf. Equivalent


Part MC3416
Description 3-Axis Accelerometer
Feature MC3416-P 3-Axis Accelerometer GENERAL DESCRIPTION FEATURES Preliminary Datasheet The MC3416-P is.
Manufacture mCube
Datasheet
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MC3416-P 3-Axis Accelerometer GENERAL DESCRIPTION FEATURES MC3416 Datasheet
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MC3416
MC3416-P 3-Axis Accelerometer
GENERAL DESCRIPTION
FEATURES
Preliminary Datasheet
The MC3416-P is a low-noise, integrated
digital output 3-axis accelerometer with a
feature set optimized for cell phones and
consumer product motion sensing.
Applications include user interface control,
gaming motion input, electronic compass tilt
compensation for cell phones, game
controllers, remote controls and portable
media products.
The MC3416-P features a dedicated motion
block which implements algorithms to
support “any motion” and shake detection,
tilt/flip and tilt 35 position detection.
Low noise and low power are inherent in
the monolithic fabrication approach, where
the MEMS accelerometer is integrated in a
single-chip with the electronics integrated
circuit.
In the MC3416-P the internal sample rate
can be set from 128 to 1024 samples /
second. The device supports the reading of
sample and event status via polling or
interrupts.
Range, Sampling & Power
±2, ±4, ±8, ±12, ±16g range
16-bit resolution
128 to 1024 samples/sec
70 to 160 μA typical active current
Simple System Integration
I2C interface, up to 1 MHz
2×2×0.94 mm 12-pin LGA package
Pin-compatible to Bosch BMA2xx
Single-chip 3D silicon MEMS
<200μg / √Hz noise
RoHS Compliant
mCube Proprietary.
APS-045-0020v1.0
© 2017 mCube Inc. All rights reserved.
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MC3416
MC3416-P 3-Axis Accelerometer
Preliminary Datasheet
TABLE OF CONTENTS
1 Order Information............................................................................................................. 4
2 Functional Block Diagram ................................................................................................ 5
3 Packaging and Pin Description ........................................................................................ 6
3.1 Package Outline................................................................................................................... 6
3.2 Package Orientation............................................................................................................. 7
3.3 Pin Description..................................................................................................................... 8
3.4 Typical Application Circuits .................................................................................................. 9
3.5 Tape and Reel ................................................................................................................... 12
3.6 Soldering Profile................................................................................................................. 14
3.7 Shipping and Handling Guidelines ..................................................................................... 14
3.8 Moisture Sensitivity Level Control ...................................................................................... 14
4 Specifications................................................................................................................. 15
4.1 Absolute Maximum Ratings................................................................................................ 15
4.2 Sensor Characteristics ....................................................................................................... 16
4.3 Electrical and Timing Characteristics.................................................................................. 17
4.3.1 Electrical Power and Internal Characteristics.................................................................. 17
4.3.2 I2C Electrical Characteristics .......................................................................................... 18
4.3.3 I2C Timing Characteristics.............................................................................................. 19
5 General Operation ......................................................................................................... 20
5.1 Sensor Sampling................................................................................................................ 20
5.2 Offset and Gain Calibration ................................................................................................ 21
6 Operational States ......................................................................................................... 22
7 Operational State Flow .................................................................................................. 23
8 Interrupts........................................................................................................................ 24
8.1 Enabling and Clearing Interrupts ........................................................................................ 24
8.2 ACQ_INT Interrupt ............................................................................................................. 24
9 Sampling........................................................................................................................ 25
9.1 Continuous Sampling ......................................................................................................... 25
10 I2C Interface .................................................................................................................. 26
10.1 Physical Interface............................................................................................................... 26
10.2 Timing ................................................................................................................................ 26
10.3 I2C Message Format.......................................................................................................... 27
mCube Proprietary.
APS-045-0020v1.0
© 2017 mCube Inc. All rights reserved.
2 / 55







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