Discharged Protection. SDT26A05L05 Datasheet

SDT26A05L05 Protection. Datasheet pdf. Equivalent


Brightking SDT26A05L05
SDT26AXXL05 SERIES
Electrostatic Discharged Protection Devices (ESD) Data Sheet
Description
Brightking’s SDT26AXXL05 series are designed to protect sensitive
electronics from damage or latch-up due to ESD and other voltage
induced transient events. Each device will protect up to five lines.
They are unidirectional devices and may be used on lines where the
signal polarities are above ground.
They feature large cross sectional area junctions for conducting high
transient currents. They offer desirable characteristics for board level
protection including fast response time, low operating and clamping
voltage and no device degradation. The series may be used to meet
the immunity requirements of IEC61000-4-2, level 4.
Features
IEC61000-4-2 ESD 15KV Air, 8KV contact compliance
SOT23-6L surface mount package
Protects five data lines
Peak power dissipation of 350W under 8/20μs waveform
Working voltage: 5V, 15V and 24V
Low leakage current
Low clamping voltage
Solid-state silicon avalanche technology
Lead Free/RoHS compliant
Solder reflow temperature: Pure Tin-Sn, 260~270
Flammability rating UL 94V-0
Meets MSL level 1, per J-STD-020
Pin Configuration
Applications
Cell phone handsets and accessories
Microprocessor based equipment
Personal digital assistants (PDA’s)
Notebooks, Desktops and Servers
Portable instrumentation
Set Top Box
Peripherals
Cordless phones
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
I/O 1
I/O 2
I/O 3
I/O 4
I/O 5
Pin 1 Pin 3 Pin 4 Pin 5 Pin 6
Pin 2
Revision16-Jul-15
www.brightking.com


SDT26A05L05 Datasheet
Recommendation SDT26A05L05 Datasheet
Part SDT26A05L05
Description Electrostatic Discharged Protection
Feature SDT26A05L05; SDT26AXXL05 SERIES Electrostatic Discharged Protection Devices (ESD) Data Sheet Description Brightk.
Manufacture Brightking
Datasheet
Download SDT26A05L05 Datasheet




Brightking SDT26A05L05
Maximum Ratings
Rating
Peak pulse power (tp=8/20μs waveform)
ESD voltage (Contact discharge)
ESD voltage (Air discharge)
Lead soldering temperature
Storage & operating temperature range
SDT26AXXL05 SERIES
Symbol
PPP
VESD
TL
TSTG ,TJ
Value
350
±8
±15
260
-55~+150
Unit
W
kV
Electrical Characteristics (TJ=25)
SDT26A05L05 (Marking: TC5)
Parameter
Reverse stand-off voltage
Reverse breakdown voltage
Reverse leakage current
Clamping voltage (tp=8/20μs)
Clamping voltage (tp=8/20μs)
Off state junction capacitance
Symbol
Condition
Min. Typ. Max. Unit
VRWM
VBR
IR
IBR=1mA
VR=5V
Each I/O pin
6
5V
V
5 μA
VC IPP=5A
VC IPP=20A
CJ
0Vdc,f=1MHz
Between I/O pins
9.5 V
18 V
200 pF
SDT26A15L05 (Marking: TCJ)
Parameter
Reverse stand-off voltage
Reverse breakdown voltage
Reverse leakage current
Clamping voltage (tp=8/20μs)
Clamping voltage (tp=8/20μs)
Off state junction capacitance
Symbol
Condition
Min. Typ. Max. Unit
VRWM
VBR
IR
IBR=1mA
VR=15V
Each I/O pin
16.7
15 V
V
5 μA
VC IPP=5A
VC IPP=10A
CJ
0Vdc,f=1MHz
Between I/O pins
24 V
35 V
70 pF
Revision16-Jul-15
www.brightking.com



Brightking SDT26A05L05
Electrical Characteristics (TJ=25)
SDT26A24L05 (Marking: TCK)
Parameter
Reverse stand-off voltage
Reverse breakdown voltage
Symbol
VRWM
VBR
Reverse leakage current
IR
Clamping voltage (tp=8/20μs)
Clamping voltage (tp=8/20μs)
VC
VC
Off state junction capacitance
CJ
SDT26AXXL05 SERIES
Condition
Min. Typ. Max. Unit
24 V
IBR=1mA
VR=24V
Each I/O pin
26.7
V
1 μA
IPP=5A
IPP=7A
0Vdc,f=1MHz
Between I/O pins
40 V
50 V
50 pF
Applications Information
I/O #1
I/O #2
I/O #3
654
Connector
Unidirectional protection of five I/O lines is achieved
by connecting pins 1, 3, 4, 5 and 6 to the data lines.
Pin 2 is connected to ground. The ground connection
should be made directly to the ground plane for best
results.
The path length is kept as short as possible to reduce
the effects of parasitic inductance in the board traces.
123
GND
I/O #4
I/O #5
GND
Figure 1. Keep short path length
Good circuit board layout is critical for the suppression of ESD induced transients.
The following guidelines are recommended:
Place the SDT26AXXL05 near the input terminals or connectors to restrict transient coupling
Minimize the path length between the SDT26AXXL05 and the protected line
Minimize all conductive loops including power and ground loops.
The ESD transient return path to ground should be kept as short as possible.
Never run critical signals near board edges.
Use ground planes whenever possible.
Revision16-Jul-15
www.brightking.com







@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site (Privacy Policy & Contact)