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Protection Devices. XESD32D24C Datasheet |
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X ESD32D24C
Electrostatic Discharged Protection Devices (ESD) Data Sheet
Description
Brightking’s XESD32D24C is desi gned to protect voltage sensitive
components from ESD and transient voltage events. Excellent clamping
capability, low leakage, and fast response time, make these parts
ideal for ESD protection on designs where board space is at a premium.
Because of its small size, it is suited for use in cellular phones, portable
devices, digital cameras, power supplies and many other portable
applications.
It is designed to protect sensitive semiconductor components from
damage or upset due to electrostatic discharge(ESD), electrical fast
transients(EFT), and cable discharge events(CDE).
Features
● IEC61000-4-2 ESD 15KV Air, 8KV contact compliance
● SOD-323 surface mount package
● Protects bi-directional line
● Peak power dissipation of 320W under 8/20μs waveform
● Working voltage: 24V
● Low leakage current
● Low clamping voltage
● Solid-state silicon avalanche technology
● Lead Free/RoHS compliant
● Solder reflow temperature: Pure Tin-Sn, 260~270℃
● Flammability rating UL 94V-0
● Meets MSL level 1, per J-STD-020
● Marking: M
Pin Configuration
Applications
● Cellular handsets & Accessories
● Cordless phones
● Personal digital assistants (PDAs)
● Notebooks & Handhelds
● Portable instrumentation
● Digital cameras
● Peripherals
● MP3 players
Maximum Ratings
Rating
Peak pulse power (tp=8/20μs waveform)
ESD voltage (Contact discharge)
ESD voltage (Air discharge)
Storage & operating temperature range
Revision：
Symbol
PPP
VESD
TSTG ,TJ
Value
320
±8
±15
-55~+150
Unit
W
kV
℃
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X ESD32D24C
Parameter
Reverse stand-off voltage
Reverse breakdown voltage
Reverse leakage current
Clamping voltage (tp=8/20μs)
Off state junction capacitance
Symbol
VRWM
VBR
IR
VC
CJ
Condition
Min. Typ. Max. Unit
24 V
IBR=1mA
26.7
V
VR=24V
1 μA
IPP=1A
43 V
0Vdc,f=1MHz
37
pF
Typical Characteristics Curves
Figure 1. Power Derating Curve
Figure 3. Capacitance vs. Reverse Voltage
Figure 2. Pulse Waveform
110
100
90
80
70
60
50
40
30
20
10
0
0
tr Peak value Ipp Waveform
Parameters:
tr=8µs
td=20µs
td=t|PP/2
5 10 15 20 25 30
t-Time (μs)
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Reflow Soldering
X ESD32D24C
Recommended Condition
Profile Feature
Average ramp-up rate (TL to TP)
Preheat
-Temperature Min (TS min)
-Temperature Max (TS max)
-Time (min to max) (ts)
TS max to TL
-Ramp-up Rate
Time maintained above:
-Temperature (TL)
-Time (tL)
Peak Temperature (TP)
Time within 5℃ of actual Peak Temperature (tP)
Ramp-down Rate
Time 25℃ to Peak Temperature
Pb-Free Assembly
3℃/second max.
150℃
200℃
60-180 seconds
3℃/second max.
217℃
60-150 seconds
260℃
20-40 seconds
6℃/second max.
8 minutes max.
Revision：
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