Flash Memory. P25Q40U-D8H Datasheet

P25Q40U-D8H Memory. Datasheet pdf. Equivalent

P25Q40U-D8H Datasheet
Recommendation P25Q40U-D8H Datasheet
Part P25Q40U-D8H
Description Serial Multi I/O Flash Memory
Feature P25Q40U-D8H; P25Q40U-D8H Datasheet P25Q40U-D8H Ultra Low Power, 4M-bit WLCSP Serial Multi I/O Flash Memory Datash.
Manufacture Puya
Datasheet
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Puya P25Q40U-D8H
P25Q40U-D8H Datasheet
P25Q40U-D8H
Ultra Low Power, 4M-bit WLCSP
Serial Multi I/O Flash Memory Datasheet
Jul. 19, 2018
Performance Highlight
Wide Supply Range from 1.65 to 3.6V for Read, Erase and Program
Ultra Low Power consumption for Read, Erase and Program
X1, X2 and X4 Multi I/O Support
High reliability with 100K cycling and 20 Year-retention
Puya Semiconductor (Shanghai) Co., Ltd
Puya Semiconductor
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Puya P25Q40U-D8H
P25Q40U-D8H Datasheet
Contents
1 Overview........................................................................................................................................................4
2 Description.....................................................................................................................................................5
3 Ball Definition.................................................................................................................................................6
3.1 Ball Configurations WLCSP...............................................................................................................6
3.2 Ball Description WLCSP ....................................................................................................................6
4 Block Diagram ...............................................................................................................................................7
5 Electrical Specifications.................................................................................................................................8
5.1 Absolute Maximum Ratings ...............................................................................................................8
5.2 DC Characteristics.............................................................................................................................9
5.3 AC Characteristics .......................................................................................................................... 10
5.4 AC Characteristics for Program and Erase .....................................................................................11
5.5 Operation Conditions ...................................................................................................................... 13
6 Data Protection........................................................................................................................................... 15
7 Memory Address Mapping.......................................................................................................................... 17
8 Device Operation........................................................................................................................................ 18
9 Hold Feature............................................................................................................................................... 20
10 Commands ......................................................................................................................................... 21
10.1 Commands listing ........................................................................................................................... 21
10.2 Write Enable (WREN)..................................................................................................................... 23
10.3 Write Disable (WRDI)....................................................................................................................... 23
10.4 Write Enable for Volatile Status Register ....................................................................................... 24
10.5 Read Status Register (RDSR).......................................................................................................... 24
10.6 Read Configure Register (RDCR) .................................................................................................... 26
10.7 Active Status Interrupt (ASI) ........................................................................................................... 27
10.8 Write Status Register (WRSR) ......................................................................................................... 28
10.9 Write Configure Register (WRCR).................................................................................................... 29
10.10 Read Data Bytes (READ)................................................................................................................. 29
10.11 Read Data Bytes at Higher Speed (FAST_READ)............................................................................ 30
10.12 Dual Read Mode (DREAD) .............................................................................................................. 31
10.13 2 X IO Read Mode (2READ) ............................................................................................................ 32
10.14 2 X IO Read Performer Enhance Mode ............................................................................................ 33
10.15 Quad Read Mode (QREAD)............................................................................................................. 34
10.16 4 X IO Read Mode (4READ) ............................................................................................................ 35
10.17 4 X IO Read Performance Enhance Mode ....................................................................................... 36
10.18 Burst Read....................................................................................................................................... 37
10.19 Page Erase (PE).............................................................................................................................. 38
10.20 Sector Erase (SE) ............................................................................................................................ 38
10.21 Block Erase (BE32K) ....................................................................................................................... 39
10.22 Block Erase (BE).............................................................................................................................. 39
10.23 Chip Erase (CE)............................................................................................................................... 40
10.24 Page Program (PP).......................................................................................................................... 41
10.25 Dual Input Page Program (DPP) ...................................................................................................... 42
10.26 Quad Page Program (QPP) ............................................................................................................. 43
10.27 Erase Security Registers (ERSCUR)................................................................................................ 44
10.28 Program Security Registers (PRSCUR) ........................................................................................... 45
10.29 Read Security Registers (RDSCUR) ................................................................................................ 46
10.30 Deep Power-down (DP) ................................................................................................................... 47
10.31 Release form Deep Power-Down (RDP), Read Electronic Signature (RES)...................................... 47
10.32 Read Electronic Manufacturer ID & Device ID (REMS) ..................................................................... 49
10.33 Dual I/O Read Electronic Manufacturer ID & Device ID (DREMS) .................................................... 50
Puya Semiconductor
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Puya P25Q40U-D8H
P25Q40U-D8H Datasheet
10.34 Quad I/O Read Electronic Manufacturer ID & Device ID (QREMS)................................................... 51
10.35 Read Identification (RDID)................................................................................................................ 52
10.36 Program/Erase Suspend/Resume.................................................................................................... 53
10.37 Erase Suspend to Program .............................................................................................................. 54
10.38 Program Resume and Erase Resume.............................................................................................. 55
10.39 No Operation (NOP) ........................................................................................................................ 55
10.40 Software Reset (RSTEN/RST) ......................................................................................................... 56
10.41 Read Unique ID (RUID) ................................................................................................................... 57
10.42 Read SFDP Mode (RDSFDP) .......................................................................................................... 58
11 Ordering Information........................................................................................................................... 63
12 Package Information 8-ball WLCSP................................................................................................... 64
13 Revision History.................................................................................................................................. 65
Puya Semiconductor
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