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GTVA261701FA

CREE

Thermally-Enhanced High Power RF GaN on SiC HEMT

GTVA261701FA Thermally-Enhanced High Power RF GaN on SiC HEMT 170 W, 50 V, 2620 – 2690 MHz Description The GTVA261701FA...


CREE

GTVA261701FA

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Description
GTVA261701FA Thermally-Enhanced High Power RF GaN on SiC HEMT 170 W, 50 V, 2620 – 2690 MHz Description The GTVA261701FA is a 170-watt (P3dB) GaN on SiC high electron mobility transistor (HEMT) for use in multi-standard cellular power amplifier applications. It features input matching, high efficiency, and a thermally-enhanced package with earless flange. GTVA261701FA Package H-37265J-2 Peak/Average Ratio, Gain (dB) Efficiency (%) Single-carrier WCDMA Drive-up VDD = 48 V, IDQ = 200 mA, ƒ = 2620 MHz 3GPP WCDMA signal, 10 dB PAR, 3.84 MHz bandwidth 32 80 28 24 Efficiency 60 40 20 20 16 Gain 0 12 -20 8 4 PAR @ 0.01% CCDF -40 -60 0 -80g261701fa-gr1a 27 31 35 39 43 47 51 Average Output Power (dBm) Features GaN on SiC HEMT technology Input Matched Typical CW performance, 2690 MHz, 48 V, single side - Output power at P3dB = 170 W - Efficiency = 75% - Gain = 15 dB Human Body Model, Class 1B (per ANSI/ESDA/ JEDEC JS-001) Capable of handling 10:1 VSWR...




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