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SMBB1550-1100 Dataheets PDF



Part Number SMBB1550-1100
Manufacturers USHIO
Logo USHIO
Description 1550nm High Power TOP LED
Datasheet SMBB1550-1100 DatasheetSMBB1550-1100 Datasheet (PDF)

Data Sheet SMBB1550-1100 1550nm High Power TOP LED Outline and Internal Circuit (Unit : mm) Features • Chip Material : InGaAsP • Chip Dimension : 1000um * 1000um • Number of Chips : 1pce • Peak Wavelength : 1550nm typ. • Lead Frame Die : Silver Plated on Copper • Package Resin : PA9T • Lens : Silicone Resin Application Absolute Maximum Ratings (Tc=25°C) Item Symbol Ratings Power Dissipation PD 1000 Forward Current IF 700 Pulse Forward Current IFP 2000 Reverse Voltage VR 3 Thermal .

  SMBB1550-1100   SMBB1550-1100


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Data Sheet SMBB1550-1100 1550nm High Power TOP LED Outline and Internal Circuit (Unit : mm) Features • Chip Material : InGaAsP • Chip Dimension : 1000um * 1000um • Number of Chips : 1pce • Peak Wavelength : 1550nm typ. • Lead Frame Die : Silver Plated on Copper • Package Resin : PA9T • Lens : Silicone Resin Application Absolute Maximum Ratings (Tc=25°C) Item Symbol Ratings Power Dissipation PD 1000 Forward Current IF 700 Pulse Forward Current IFP 2000 Reverse Voltage VR 3 Thermal Resistance Rthja 10 Junction Temperature Tj 120 Operating Temperature Topr -40 ~ +100 Storage Temperature Tstg -40 ~ +100 Soldering Temperature TSOL 250 ‡Pulse Forward Current condition : Duty 1% and Pulse Width=10us. ‡Soldering condition : Soldering condition must be completed with 5 seconds at 250°C. Optical and Electrical Characteristics (Tc=25°C) Parameter Symbol Min Typ Max Unit Forward Voltage VF VFP 1.0 1.4 1.5 Total Radiated Power PO 16 35 .


APM2309 SMBB1550-1100 EDC910D-1100-S5


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