General Purpose Rectifier GPP Chips
DGS60 THRU DGS70
General Purpose Rectifier GPP Chips
Features
˙ Fully glass passivated -needs no encapsulation ˙ Peak ...
Description
DGS60 THRU DGS70
General Purpose Rectifier GPP Chips
Features
˙ Fully glass passivated -needs no encapsulation ˙ Peak reverse voltage to 1800 volts ˙ Low forward voltage drop(VF) ˙ Metallized surface
Glass
AT w
Description
The GPP chips series are diffused silicon, glass passivated rectifier die.
These devices can be supplied to meet customer’s requirements.
The prime application for unencapsulated die is in hybrid circuits. For
this reason, a variety of metallized surfaces are available.
Gold is standard for wire bonding, and for soldering application, gold flash chips are supplied.
Electrical Characteristics (TA = 25oC unless specified)
PAR AMETER
SYMBOL
DGS60
DGS70
UNIT
Dimension
W
60±3
70±3
mils
Dimension
A
45±3
57±3
mils
Dimension
T
265±8
μm
Peak Inverse Voltage Forward current Forward Voltage Drop Forward Surge current
VB 1100
IF 1.5~2.0 2.0
VF
≤ 0.98
≤ 0.98
IFSM
50
50
Volts Amps Volts Amps
Reverse Recovery Time Junction Te...
Similar Datasheet