Ultra Module. Ag5510 Datasheet

Ag5510 Module. Datasheet pdf. Equivalent

Part Ag5510
Description PoE Ultra Module
Feature Silvertel V1.1 August 2016 Datasheet Ag5510 PoE Ultra Module 1. Features 60 Watt Output Power Very.
Manufacture Silver Telecom
Total Page 19 Pages
Datasheet
Download Ag5510 Datasheet



Ag5510
Silvertel
V1.1 August 2016
Datasheet
Ag5510
PoE Ultra Module
1. Features
60 Watt Output Power
Very small size
High efficiency DC/DC converter
Wide adjustable output voltage range
1500V isolation (input to output)
Input voltage range 36V to 57V
IEEE802.3at compliant
Low output ripple and noise
Minimal (low cost) external components
required
Overload, thermal and short-circuit
protection
Silvertel “design-in” assistance
2. Description
The Ag5510 is a High Power over Ethernet (PoE Ultra) module that can deliver up to 60 Watts
of output power. Suitable for applications such as WiMAX access points, PTZ cameras,
notebook computers and thin client terminals.
The Ag5510 has been designed to extract power from Power Sourcing Equipment (PSE) over
an Ethernet cable. The module’s input conforms to the IEEE 802.3at standard for signature
recognition and class programming. It has been designed to work with existing high power
PSE’s from leading manufacturers.
The high efficiency DC/DC converter operates over a wide input voltage range and provides a
regulated low ripple and low noise output. The DC/DC converter also has built-in overload,
thermal and short-circuit output protection.
© Silver Telecom 2016



Ag5510
V 1.1 August 2016
Data Sheet
Ag5510
PoE Ultra Module
Table of Contents
1. Features ........................................................................................................................ 1
2. Description .................................................................................................................... 1
Table of Contents.............................................................................................................. 2
Table of Figures ................................................................................................................ 2
3. Ag5510 Product Selector............................................................................................... 3
4. Pin Description .............................................................................................................. 4
5. Functional Description ...................................................................................................... 5
5.1 Inputs .......................................................................................................................... 5
5.2 PD Signature............................................................................................................... 5
5.3 Isolation....................................................................................................................... 6
5.4 Power Classification.................................................................................................... 6
5.5 High Power Applications ............................................................................................. 7
5.6 DC/DC Converter ........................................................................................................ 8
5.7 Output Configuration ................................................................................................... 8
5.8 Output Adjustment ...................................................................................................... 8
5.9 Output Power .............................................................................................................. 9
5.10 Typical Connections................................................................................................ 10
5.11 Additional Output Filtering....................................................................................... 10
6. Operating Temperature Range...................................................................................... 12
7. Protection ...................................................................................................................... 13
8. EMC............................................................................................................................... 13
9. Electrical Characteristics ............................................................................................... 14
9.1 Absolute Maximum Ratings1 ..................................................................................... 14
9.2 Recommended Operating Conditions ....................................................................... 15
9.3 DC Electrical Characteristics..................................................................................... 15
10. Package....................................................................................................................... 16
10.1 Heat Sink Assembly ................................................................................................ 17
10.2 PCB Thermal Layout............................................................................................... 18
10.3 Heatpad Footprint ................................................................................................... 19
Table of Figures
Figure 1: Block Diagram ....................................................................................................... 3
Figure 2: Ag5510 Package Format....................................................................................... 3
Figure 3: Typical System Diagram........................................................................................ 5
Figure 4: Class Programming Option ................................................................................... 6
Figure 5: High Power configuration ...................................................................................... 7
Figure 6: Output Configurations............................................................................................ 8
Figure 7: Output Adjustment................................................................................................. 9
Figure 8: Typical Connection Diagram ............................................................................... 10
Figure 9: Additional Output Filtering ................................................................................... 11
Figure 10: Operating Temperature ..................................................................................... 12
Figure 11: Operating Temperature (Thermally connected to PCB) .................................... 13
Figure 12: EMC Filtering..................................................................................................... 14
Figure 13: Suggested Heat Sink Assembly ........................................................................ 17
Figure 14: Suggested PCB Thermal Layout ....................................................................... 18
Figure 15: Suggested Heatpad Footprint............................................................................ 19
© Silver Telecom 2016
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