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IS61NLP51236B Dataheets PDF



Part Number IS61NLP51236B
Manufacturers ISSI
Logo ISSI
Description 18Mb STATE BUS SYNCHRONOUS SRAM
Datasheet IS61NLP51236B DatasheetIS61NLP51236B Datasheet (PDF)

IS61NLP51236(32)B/IS61NVP51236(32)B/IS61NVVP51236(32)B IS61NLP102418B/IS61NVP102418B/IS61NVVP102418B 512K x36 and 1024K x18 18Mb, PIPELINE 'NO WAIT' STATE BUS SYNCHRONOUS SRAM AUGUST 2019 FEATURES • 100 percent bus utilization • No wait cycles between Read and Write • Internal self-timed write cycle • Individual Byte Write Control • Single R/W (Read/Write) control pin • Clock controlled, registered address, data and control • Interleaved or linear burst sequence control using MODE input • Thre.

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IS61NLP51236(32)B/IS61NVP51236(32)B/IS61NVVP51236(32)B IS61NLP102418B/IS61NVP102418B/IS61NVVP102418B 512K x36 and 1024K x18 18Mb, PIPELINE 'NO WAIT' STATE BUS SYNCHRONOUS SRAM AUGUST 2019 FEATURES • 100 percent bus utilization • No wait cycles between Read and Write • Internal self-timed write cycle • Individual Byte Write Control • Single R/W (Read/Write) control pin • Clock controlled, registered address, data and control • Interleaved or linear burst sequence control using MODE input • Three chip enables for simple depth expansion and address pipelining • Power Down mode • Common data inputs and data outputs • /CKE pin to enable clock and suspend operation • JEDEC 100-pin QFP, 165-ball BGA and 119- ball BGA packages • Power supply: NLP: VDD 3.3V (± 5%), VDDQ 3.3V/2.5V (± 5%) NVP: VDD 2.5V (± 5%), VDDQ 2.5V (± 5%) NVVP: VDD 1.8V (± 5%), VDDQ 1.8V (± 5%) • JTAG Boundary Scan for BGA packages • Commercial, Industrial and Automotive (x36) temperature support • Lead-free available • For leaded option, please contact ISSI. DESCRIPTION The 18Meg product family features high-speed, lowpower synchronous static RAMs designed to provide a burstable, high-performance, 'no wait' state, device for networking and communications applications. They are organized as 512K words by 36 bits and 1024K words by 18 bits, fabricated with ISSI's advanced CMOS technology. Incorporating a 'no wait' state feature, wait cycles are eliminated when the bus switches from read to write, or write to read. This device integrates a 2-bit burst counter, high-speed SRAM core, and highdrive capability outputs into a single monolithic circuit. All synchronous inputs pass through registers are controlled by a positive-edge-triggered single clock input. Operations may be suspended and all synchronous inputs ignored when Clock Enable, /CKE is HIGH. In this state the internal device will hold their previous values. All Read, Write and Deselect cycles are initiated by the ADV input. When the ADV is HIGH the internal burst counter is incremented. New external addresses can be loaded when ADV is LOW. Write cycles are internally self-timed and are initiated by the rising edge of the clock inputs and when /WE is LOW. Separate byte enables allow individual bytes to be written. A burst mode pin (MODE) defines the order of the burst sequence. When tied HIGH, the interleaved burst sequence is selected. When tied LOW, the linear burst sequence is selected. FAST ACCESS TIME Symbol tKQ tKC Parameter Clock Access Time Cycle time Frequency -250 2.6 4 250 -200 3.0 5 200 Units ns ns MHz Copyright © 2019 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products. Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that: a.) the risk of injury or damage has been minimized; b.) the user assume all such risks; and c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances Integrated Silicon Solution, Inc.- www.issi.com 1 Rev. D2 08/12/2019 IS61NLP51236(32)B/IS61NVP51236(32)B/IS61NVVP51236(32)B IS61NLP102418B/IS61NVP102418B/IS61NVVP102418B BLOCK DIAGRAM (X= a,b,c,d or Integrated Silicon Solution, Inc.- www.issi.com 2 Rev. D2 08/12/2019 IS61NLP51236(32)B/IS61NVP51236(32)B/IS61NVVP51236(32)B IS61NLP102418B/IS61NVP102418B/IS61NVVP102418B PIN CONFIGURATION 512K x 36, 165-Ball BGA (Top View) 1 2 A NC A B NC A C DQPc NC D DQc DQc E DQc DQc F DQc DQc G DQc DQc H NC NC J DQd DQd K DQd DQd L DQd DQd M DQd DQd N DQPd NC P NC NC R MODE NC 3 /CE CE2 VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A A 4 /BWc /BWd VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A A 5 /BWb /BWa VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC TDI TMS 6 /CE2 CLK VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC A1* A0* 7 /CKE /WE VSS VSS VSS VSS VSS VSS VSS VSS VSS VSS NC TDO TCK 8 ADV /OE VSS VDD VDD VDD VDD VDD VDD VDD VDD VDD VSS A A 9 A A VDDQ VDDQ VDDQ VDDQ VDDQ NC VDDQ VDDQ VDDQ VDDQ VDDQ A A 10 A A NC DQb DQb DQb DQb NC DQa DQa DQa DQa NC A A 11 NC NC DQPb DQb DQb DQb DQb ZZ DQa DQa DQa DQa DQPa NC A Note: A0 and A1 are the two least significant bits (LSB) of the address field and set the internal burst counter.


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