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US2BA Datasheet PDF

ON Semiconductor

Posted Mar 8, 2019 (Stock #: 1340398)



Part Number US2BA
Manufacturers ON Semiconductor
Description Super Fast Surface Mount Rectifiers
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Super Fast Surface Mount Rectifiers US2AA-US2MA  Features • Glass Passivated Chip Junction • High Surge Capacity • Low Forward Voltage Drop • Fast Switching with Reverse Recovery Time: 50∼75 ns Maximum • UL Flammability 94 V − 0 Classification • MSL 1 per J−STD−020 • RoHS Compliant / Green Molding Compound • NRV Prefix for Automotive and Other Appl
More View ications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable* Table 1. ORDERING INFORMATION Part Number US2AA, NRVUS2AA* US2BA, NRVUS2BA* US2DA, NRVUS2DA* US2FA, NRVUS2FA* US2GA, NRVUS2GA* US2JA, NRVUS2JA* US2KA, NRVUS2KA* US2MA, NRVUS2MA* Top Mark US2AA US2BA US2DA US2FA US2GA US2JA US2KA US2MA Package DO−214AC (SMA) DO−214AC (SMA) DO−214AC (SMA) DO−214AC (SMA) DO−214AC (SMA) DO−214AC (SMA) DO−214AC (SMA) DO−214AC (SMA) Packing Method Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel Tape and Reel www.onsemi.com 1 Cathode 2 Anode 1 2 SMA/DO−214AC COLOR BAND DENOTES CATHODE MARKING DIAGRAM $Y&Z&3 US2XA $Y &Z &3 US2XA X = ON Semiconductor Logo = Assembly Plant Code = Data Code (Year & Week) = Specific Device Code = A/B/D/F/G/J/K/M © Semiconductor Components Industries, LLC, 2018 1 February, 2021 − Rev. 4 Publication Order Number: US2AA/D US2AA−US2MA Table 2. ABSOLUTE MAXIMUM RATINGS Symbol Parameter US2 US2 US2 US2 US2 US2 US2 US2 AA BA DA FA GA JA KA MA Unit VRRM VRMS VDC IF(AV) IFSM Repetitive Peak Reverse Voltage RMS Reverse Voltage DC Blocking Voltage Average Forward Rectified Current Peak Forward Surge Current, 8.3 ms Single Half−Sine Wave, Superimposed on Rated Load 50 100 200 300 400 600 800 1000 V 35 70 140 210 280 420 560 700 V 50 100 200 300 400 600 800 1000 V 1.5 A 50 A TJ Operating Junction Temperature Range −55 to +150 °C TSTG Storage Temperature Range −55 to +150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Table 3. THERMAL CHARACTERISTICS (NOTE 1) (Values are at TA = 25°C unless otherwise noted) Symbol Parameter RqJA Typical Thermal Resistance, Junction−to−Ambient YJL Typical Thermal Characteristics, Junction−to−Lead (with Reference to Cathode Pin) 1. Device mounted at minimum pad. Value 189 31 Unit °C/W °C/W Table 4. ELECTRICAL CHARACTERISTICS (Values are at TA = 25°C unless otherwise noted) Value Symbol Parameter US2 US2 US2 US2 US2 US2 US2 US2 AA BA DA FA GA JA KA MA Unit VF Maximum Instantaneous Forward Voltage (Note2) at Rated IF(AV) IR Maximum Re- TJ = 25°C verse Current at Rated VR TJ = 125°C 1.0 1.3 1.7 V 5 mA 100 trr Maximum Reverse Recovery Time (Note 3) 50 CJ Typical Junction Capacitance (Note 4)
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