FMN4ST2TCK-25IF

FMN4xT2TCK-25Ix Datasheet Stacked Multi-Chip Product(MCP) FMN4xT2TCK-25Ix Datasheet Do not leave this document unattended. This information contained in this document covered by the non-discloser agreement. Do not reproduce this document. This document is property of Fidelix Co., Ltd. and maybe be required to be returned at any time. Fidelix Co., Ltd. Revision 0.3 Jun. 2015 FMN4xT2TCK-25Ix Datasheet Stacked Multi-Chip Product(MCP) Document Title Stacked Multi-Chip Product (NAND=4G, LPDDR2=2G) Revision History Revision No. History 0.0 Initial Draft 0.1 Revised IDD Specification of DRAM 0.2 Revised IDD Specification of DRAM 0.3 Revised Package Dimension (8.0mm X 10.5mm) Draft date Nov. 1st, 2014 Nov. 4th, 2014 Mar. 24th, 2015 Jun. 2nd, 2015 Remark Preliminary Final 1 Revision 0.3 Jun. 2015 FMN4xT2TCK-25Ix Datasheet Stacked Multi-Chip Product(MCP) Stacked Multi-Chip Product(MCP) 1.8V NAND Flash Memory and Mobile DDR2 1. MCP Features Operating Tem...