Energy Module. ISP1807 Datasheet

ISP1807 Module. Datasheet pdf. Equivalent

Part ISP1807
Description Built-in Antenna Low Energy Module
Feature ISP1807 Built-in Antenna Low Energy Module BT 5 Long Range, Zigbee, Thread, ANT+ This ultra-small LG.
Manufacture Insight SiP
Datasheet
Download ISP1807 Datasheet



ISP1807
ISP1807
Built-in Antenna Low Energy Module
BT 5 Long Range, Zigbee, Thread, ANT+
This ultra-small LGA module, 8 x 8 x 1 mm, is based on
the nRF52840 Chip. Its powerful Cortex™ M4 CPU,
flash and RAM memory combined with an optimized
antenna offers the perfect solution for Bluetooth
connectivity. The solution is best in class for RF
performance and low power consumption. Long range
and multiple digital and analogue interfaces give
optimum flexibility for sensor integration.
Key Features
2.4GHz Ultra Low Power RF Transceiver
Full Bluetooth 5 long range stack
ANT/ANT+ stack
2.4 GHz proprietary stack
BT Mesh, Zigbee, Thread stacks available
NFC-A Tag for OOB pairing
Fully integrated RF matching and Antenna
Integrated 32 MHz& 32kHZ Clock
DC/DC converter with loading circuit
Based on Nordic Semiconductor nRF52
32-bit ARM Cortex M4F CPU
ARM CryptoCell 310
1 MB Flash / 256 kB SRAM
Configurable 46 GPIOs including 8 ADC
Many interfaces USB, SPI, UART, PDM, I2C
Power supply 1.7 to 3.6V, USB supply 5V
Very small size 8.0 x 8.0 x 1.0 mm
Temperature -40 to +85 °C
Pin to Pin compatible with ISP1507
Applications
Advanced Wearables: watches, fitness
devices, wireless payment wearables,
connected health, augmented reality
applications …
Smart Home sensors and controllers
Industrial IoT sensors and controllers
Advanced remote controls
Remote &Gaming controllers
Beacons
Certifications
FCC certification pending
CE certification pending
IC certification pending
TELEC certification pending
Bluetooth SIG certification pending
RoHS compliant
March 14, 2019
Page 1/23
Document Ref: isp_ble_DS1807_R6.docx
Insight SiPGreen Side 400 avenue Roumanille BP 309 06906 Sophia-Antipolis Cedex France www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to a ny third party without written permission.
Specification subject to change without notice.



ISP1807
BLE MODULE
ISP1807
Contents
1. Block Diagram........................................................................................................................................ 3
2. Specifications......................................................................................................................................... 4
2.1. Important Notice............................................................................................................................4
2.2. Absolute Maximum Ratings...........................................................................................................4
2.3. Operating Conditions ....................................................................................................................4
2.4. Power Consumption......................................................................................................................5
2.5. Clock Sources...............................................................................................................................5
2.6. Radio Specifications......................................................................................................................5
2.7. Range Measurement.....................................................................................................................6
2.8. Antenna Performance ...................................................................................................................6
2.9. Electrical Schematic......................................................................................................................8
3. Pin Description ...................................................................................................................................... 9
4. Mechanical Outlines............................................................................................................................ 12
4.1. Mechanical Dimensions ..............................................................................................................12
4.2. SMT Assembly Guidelines ..........................................................................................................13
4.3. Antenna Keep-Out Zone .............................................................................................................13
5. Product Development Tools .............................................................................................................. 14
5.1. Hardware ....................................................................................................................................14
5.2. Firmware .....................................................................................................................................14
5.3. Development Tools .....................................................................................................................15
6. Packaging & Ordering information.................................................................................................... 16
6.1. Marking .......................................................................................................................................16
6.2. Prototype Packaging ...................................................................................................................16
6.3. Jedec Trays ................................................................................................................................16
6.4. Tape and Reel ............................................................................................................................17
6.5. Ordering Information ...................................................................................................................18
7. Storage & Soldering information....................................................................................................... 19
7.1. Storage and Handling .................................................................................................................19
7.2. Moisture Sensitivity .....................................................................................................................19
7.3. Soldering information ..................................................................................................................20
8. Quality & User information................................................................................................................. 21
8.1. Certifications ...............................................................................................................................21
8.2. USA User information...............................................................................................................21
8.3. Canada User information .........................................................................................................21
8.4. RF Exposure Information ............................................................................................................22
8.5. Informations concernant l'exposition aux fréquences radio (RF)..................................................22
8.6. Discontinuity................................................................................................................................22
8.7. Disclaimer ...................................................................................................................................23
March 14, 2019
Page 2/23
Document Ref: isp_ble_DS1807_R6.docx
Insight SiPGreen Side 400 avenue Roumanille BP 309 06906 Sophia-Antipolis Cedex France www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.





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