Energy Module. ISP1302 Datasheet

ISP1302 Module. Datasheet pdf. Equivalent

Part ISP1302
Description Lite V4.2 Bluetooth Low Energy Module
Feature ISP1302 Lite V4.2 Bluetooth Low Energy Module with MCU and Antenna This ultra-small LGA module, 8 x .
Manufacture Insight SiP
Datasheet
Download ISP1302 Datasheet



ISP1302
ISP1302
Lite V4.2 Bluetooth Low Energy Module
with MCU and Antenna
This ultra-small LGA module, 8 x 8 x 1 mm, is based on
the nRF51822 Chip. Its powerful Cortex™ M0 CPU, flash
and RAM memory combined with an optimized antenna
offers the perfect solution for Bluetooth connectivity.
The solution is best in class for RF performance and low
power consumption. Multiple digital and analogue
interfaces give optimum flexibility for sensor
integration.
Key Features
Applications
Single Mode BLE V4.2 Compliant
IPv6 Connectivity
ECDH Encryption
Based on Nordic Semiconductor nRF51
2.4GHz low energy RF Transceiver
32bit ARM Cortex M0 CPU
128 kB or 256 kB Flash
16 kB SRAM
16 GPIOs including 5 ADC inputs & 1 ADC
reference
Ultra Low Power Consumption
Single 1.8 to 3.6 V supply
Very small size 8.0 x 8.0 x 1.0 mm
Temperature -40 to +85 °C
Fully integrated RF matching and Antenna
Integrated 16 MHz Clock
Possibility to connect external 32.768 kHz
Possibility to enable DC-DC converter by
adding external passive components
High volume BLE applications
Connected sensors for medical devices,
healthcare, sport, fitness, industrial …
IoT applications, connected objects
Wearable technology
Home automation
BLE connectivity for any
existing application
Beacons
Certifications
Bluetooth SIG certified QDL listing
Fully CE certified module
Fully FCC certified module
Fully IC certified module
Fully IMOC certified module
Fully TELEC certified module
RoHS compliant
January 23, 2018
Page 1/24
Document Ref: isp_ble_DS1302_R5.docx
Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia-Antipolis Cedex France www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.



ISP1302
BLE MODULE
ISP1302
Contents
1. Block Diagram ..........................................................................................................................................................3
2. Specifications ...........................................................................................................................................................4
2.1. Important Notice ...........................................................................................................................................4
2.2. Absolute Maximum Ratings...........................................................................................................................4
2.3. Operating Conditions ....................................................................................................................................4
2.4. Power Consumption......................................................................................................................................5
2.5. Clock Sources...............................................................................................................................................5
2.6. Radio Specifications......................................................................................................................................5
2.7. Electrical Schematic......................................................................................................................................8
3. Pin Description .......................................................................................................................................................10
4. Mechanical Outlines...............................................................................................................................................12
4.1. Mechanical Dimensions ..............................................................................................................................12
4.2. SMT Assembly Guidelines ..........................................................................................................................13
4.3. Antenna Keep-Out Zone .............................................................................................................................13
5. Product Development Tools .................................................................................................................................14
5.1. Hardware ....................................................................................................................................................14
5.2. Firmware ....................................................................................................................................................14
5.3. Development Tools .....................................................................................................................................15
5.4. Serialization API .........................................................................................................................................15
6. Reference Designs.................................................................................................................................................16
6.1. Sensor Board Design ..................................................................................................................................16
6.2. Beacon Design ...........................................................................................................................................17
7. Packaging & Ordering information ......................................................................................................................18
7.1. Marking.......................................................................................................................................................18
7.2. Prototype Packaging...................................................................................................................................18
7.3. Jedec Trays ................................................................................................................................................18
7.4. Tape and Reel ............................................................................................................................................19
7.5. Ordering Information ...................................................................................................................................20
8. Storage & Soldering information..........................................................................................................................21
8.1. Storage and Handling .................................................................................................................................21
8.2. Moisture Sensitivity .....................................................................................................................................21
8.3. Soldering information ..................................................................................................................................22
9. Quality & User information....................................................................................................................................23
9.1. Certifications...............................................................................................................................................23
9.2. USA User information ..............................................................................................................................23
9.3. Canada User Information .........................................................................................................................23
9.4. Discontinuity ...............................................................................................................................................24
9.5. Disclaimer...................................................................................................................................................24
January 23, 2018
Page 2/24
Document Ref: isp_ble_DS1302_R5.docx
Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia-Antipolis Cedex France www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.





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