Energy Module. ISP1510 Datasheet

ISP1510 Module. Datasheet pdf. Equivalent

Part ISP1510
Description Smart Ultra Wide Band and Bluetooth Low Energy Module
Feature Preliminary Data Sheet ISP1510 Smart Ultra Wide Band and Bluetooth Low Energy Module with MCU and A.
Manufacture Insight SiP
Datasheet
Download ISP1510 Datasheet



ISP1510
Preliminary Data Sheet
ISP1510
Smart Ultra Wide Band and Bluetooth
Low Energy Module with MCU and Antennas
This highly miniaturized LGA module, 9 x 16 x 1.9 mm, is
based on the DW1000 UWB transceiver and nRF52832 BLE
chip. Using a simple user interface via the SPI connection
and integrating a Cortex™ M4 CPU, flash and RAM memory
combined with optimized antennas, ISP1510 offers the
perfect stand-alone ranging module solution for security
bubble applications. For longer range applications, ISP1510
can be used in conjunction with an external UWB antenna.
Alternatively, it can also be connected to an external MCU.
Key Features
IEEE802.15.4-2011 UWB compliant
Single Mode BLE 5 Ready
NFC-A Tag for OOB pairing
Spatial resolution better than 10 cm
Fully integrated UWB & BLE matching
and Antennas
Integrated UWB 38.4 MHz and BLE 32 MHz
& 32.768 kHz Clocks
DC/DC converters
UWB section based on DecaWave DW1000
BLE section based on Nordic Semi nRF52
Externally Controlled or using embedded
32-bit ARM Cortex M4 CPU
512 kB Flash and 64 kB SRAM
Analog and Digital peripherals
SPI interface
Supply Voltage 2.8V to 3.6V
Very small size 9.0 x 16.0 x 1.9 mm
Temperature -40 to +85 °C
Ultra-small size 9.0 x 16.0 x 1.9 mm
Applications
Precision Real Time Location Systems
(RTLS) for Healthcare, Sport and Wellness,
Consumer, Industrial
Security bubble
Access control
Indoor positioning
Pending Certifications
Fully FCC certified module
Fully CE certified module
Fully IC certified module
Bluetooth SIG certified QDL listing
RoHS compliant
June 20, 2017
Page 1/26
Document Ref: isp_ble_DS1510_R2.docx
Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia-Antipolis Cedex France www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.



ISP1510
Contents
UWB+BLE MODULE
ISP1510
Preliminary Data Sheet
1. Block Diagram...............................................................................................................................................................3
2. Specifications................................................................................................................................................................4
2.1. Absolute Maximum Ratings .............................................................................................................................4
2.2. Operating Conditions .......................................................................................................................................4
2.3. Current Consumption.......................................................................................................................................5
2.4. Clock Sources ..................................................................................................................................................5
2.5. Radio Specifications ........................................................................................................................................6
2.6. Electrical Schematic.........................................................................................................................................8
3. Pin Description..............................................................................................................................................................9
4. Mechanical Outlines...................................................................................................................................................12
4.1. Mechanical Dimensions .................................................................................................................................12
4.2. SMT Assembly Guidelines.............................................................................................................................14
4.3. Antenna Keep-Out Zone ................................................................................................................................14
5. Product Development Tools.....................................................................................................................................15
5.1. Hardware........................................................................................................................................................15
5.2. Firmware ........................................................................................................................................................15
5.3. Development Tools ........................................................................................................................................16
6. Reference Design .......................................................................................................................................................17
6.1. Anchor Board Design .....................................................................................................................................17
6.2. Tag Board Design ..........................................................................................................................................18
7. Packaging & Ordering information..........................................................................................................................20
7.1. Marking ..........................................................................................................................................................20
7.2. Prototype Packaging......................................................................................................................................20
7.3. Jedec Trays....................................................................................................................................................20
7.4. Tape and Reel ...............................................................................................................................................21
7.5. Ordering Information ......................................................................................................................................21
8. Storage & Soldering information .............................................................................................................................22
8.1. Storage and Handling ....................................................................................................................................22
8.2. Moisture Sensitivity ........................................................................................................................................22
8.3. Soldering information .....................................................................................................................................23
9. Quality & User information .......................................................................................................................................24
9.1. Pending Certifications ....................................................................................................................................24
9.2. USA User information .................................................................................................................................24
9.3. Canada User information ............................................................................................................................24
9.4. RF Exposure Information ...............................................................................................................................25
9.5. Informations concernant l'exposition aux fréquences radio (RF) ..................................................................25
9.6. Discontinuity...................................................................................................................................................25
9.7. Disclaimer ......................................................................................................................................................26
June 20, 2017
Page 2/26
Document Ref: isp_ble_DS1510_R2.docx
Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia-Antipolis Cedex France www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.





@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site (Privacy Policy & Contact)