Energy Module. ISP1303 Datasheet

ISP1303 Module. Datasheet pdf. Equivalent

Part ISP1303
Description High Performance Bluetooth V4.2 & ANT Low Energy Module
Feature ISP130301 High Performance Bluetooth V4.2 & ANT(1) Low Energy Module with MCU and Antenna This tiny .
Manufacture Insight SiP
Datasheet
Download ISP1303 Datasheet



ISP1303
ISP130301
High Performance Bluetooth V4.2 & ANT(1)
Low Energy Module with MCU and Antenna
This tiny LGA module, 8 x 11 x 1.2 mm, is based on the
nRF51 series Chip. Its powerful Cortex™ M0 CPU,
flash and RAM memory combined with an optimized
antenna offers the perfect solution for Bluetooth
connectivity. The solution is best in class for RF
performance and low power consumption. All chip
digital and analogue interfaces are available and give
optimum capabilities for sensor integration.
Key Features
Single Mode BLE V4.2 Compliant
(1) ANT+ protocol in option
IPv6 Connectivity
ECDH Encryption
Based on Nordic Semiconductor nRF51
2.4GHz low energy RF Transceiver
32bit ARM Cortex M0 CPU
256 kB Flash
16 kB or 32 kB SRAM in option
30 GPIOs including 6 ADC inputs and / or
2 ADC reference
Ultra Low Power Consumption
Single 1.8 to 3.6 V supply
Very small size 8.0 x 11.0 x 1.2 mm
Temperature -40 to +85 °C
Fully integrated RF matching and Antenna
Integrated 16 MHz Clock
Integrated 32.768 kHz Synchronization
DC-DC loading circuit fully integrated
Applications
Connected sensors for medical devices,
healthcare, sport, fitness, industrial …
IoT applications, connected objects
Wearable technology
Home automation
Beacons
Certifications
Bluetooth SIG certified QDL listing
Fully CE certified module
Fully FCC certified module
Fully IC certified module
Fully IMOC certified module
Fully TELEC certified module
RoHS compliant
January 16, 2017
Page 1/24
Document Ref: isp_ble_DS130301_R13.docx
Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia-Antipolis Cedex France www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.



ISP1303
BLE MODULE
ISP130301
Contents
1. Block Diagram ............................................................................................................................................................3
2. Specifications.............................................................................................................................................................4
2.1. Absolute Maximum Ratings...........................................................................................................................4
2.2. Operating Conditions.....................................................................................................................................4
2.3. Power Consumption ......................................................................................................................................5
2.4. Clock Sources ...............................................................................................................................................5
2.5. Radio Specifications ......................................................................................................................................5
2.6. Electrical Schematic ......................................................................................................................................8
3. Pin Description...........................................................................................................................................................9
4. Mechanical Outlines................................................................................................................................................11
4.1. Mechanical Dimensions ..............................................................................................................................11
4.2. SMT Assembly Guidelines ..........................................................................................................................12
4.3. Antenna Keep-Out Zone .............................................................................................................................13
5. Product Development Tools ..................................................................................................................................14
5.1. Hardware .....................................................................................................................................................14
5.2. Firmware......................................................................................................................................................14
5.3. Development Tools .....................................................................................................................................15
6. Reference Designs ..................................................................................................................................................16
6.1. Sensor Board Design ..................................................................................................................................16
6.2. Beacon Design ............................................................................................................................................17
7. Packaging & Ordering information.......................................................................................................................18
7.1. Marking........................................................................................................................................................18
7.2. Prototype Packaging ...................................................................................................................................18
7.3. Jedec Trays .................................................................................................................................................18
7.4. Tape and Reel .............................................................................................................................................19
7.5. Ordering Information ...................................................................................................................................20
8. Storage & Soldering information ..........................................................................................................................21
8.1. Storage and Handling..................................................................................................................................21
8.2. Moisture Sensitivity .....................................................................................................................................21
8.3. Soldering information ..................................................................................................................................22
9. Quality & User information.....................................................................................................................................23
9.1. Certifications................................................................................................................................................23
9.2. USA User information...............................................................................................................................23
9.3. Canada User information .........................................................................................................................23
9.4. Discontinuity ................................................................................................................................................24
9.5. Disclaimer....................................................................................................................................................24
January 16, 2017
Page 2/24
Document Ref: isp_ble_DS130301_R13.docx
Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia-Antipolis Cedex France www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.





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