Energy Module. ISP1507 Datasheet

ISP1507 Module. Datasheet pdf. Equivalent

Part ISP1507
Description High Performance Bluetooth 5 Ready Low Energy Module
Feature ISP1507 High Performance Bluetooth 5 Ready, NFC* & ANT Low Energy Module with MCU & Antenna This ult.
Manufacture Insight SiP
Datasheet
Download ISP1507 Datasheet



ISP1507
ISP1507
High Performance Bluetooth 5 Ready, NFC*
& ANT Low Energy Module with MCU & Antenna
This ultra-small LGA module, 8 x 8 x 1 mm, is based on
the nRF52 Chip. Its powerful Cortex™ M4 CPU, flash
and RAM memory combined with an optimized
antenna offers the perfect solution for Bluetooth
connectivity. The solution is best in class for RF
performance and low power consumption. Multiple
digital and analogue interfaces give optimum flexibility
for sensor integration.
Key Features
Multi-protocol 2.4GHz Ultra Low Power
RF Transceiver
Bluetooth 5-Ready stack
ANT/ANT+ stack
2.4 GHz proprietary stack
(*) NFC-A Tag for OOB pairing in option
Fully integrated RF matching and Antenna
Integrated 32 MHz& 32kHZ Clock
DC/DC converter with loading circuit
Based on Nordic Semiconductor nRF52
32-bit ARM Cortex M4 CPU
512 kB Flash and 64 kB SRAM
or 192 kB Flash and 24 kB SRAM versions
From 13 to 30 configurable GPIOs including
up to 3 to 8 ADC
Many interfaces SPI, UART, PDM, I2C
Single 1.7 to 3.6 V supply
Very small size 8.0 x 8.0 x 1.0 mm
Temperature -40 to +85 °C
Applications
Connected sensors for medical devices,
healthcare, sport, fitness, industrial …
IoT applications, connected objects
Wearable technology
Home automation
Beacons
Certifications
Fully FCC certified module
Fully CE certified module
Fully IC certified module
Fully TELEC certified module
Bluetooth SIG certified QDL listing
RoHS compliant
December 14, 2018
Page 1/28
Document Ref: isp_ble_DS1507_R12.docx
Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia-Antipolis Cedex France www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.



ISP1507
BLE MODULE
ISP1507
Contents
1. Block Diagram .......................................................................................................................................................3
2. Specifications ........................................................................................................................................................4
2.1. General Notice ...........................................................................................................................................4
2.2. Absolute Maximum Ratings ........................................................................................................................4
2.3. Operating Conditions..................................................................................................................................4
2.4. Power Consumption ...................................................................................................................................5
2.5. Clock Sources ............................................................................................................................................5
2.6. Radio Specifications ...................................................................................................................................5
2.7. Electrical Schematic ...................................................................................................................................8
3. Pin Description ....................................................................................................................................................10
4. Mechanical Outlines............................................................................................................................................13
4.1. Mechanical Dimensions............................................................................................................................13
4.2. SMT Assembly Guidelines........................................................................................................................14
4.3. Antenna Keep-Out Zone...........................................................................................................................14
5. Product Development Tools...............................................................................................................................15
5.1. Hardware .................................................................................................................................................15
5.2. Firmware ..................................................................................................................................................15
5.3. Development Tools...................................................................................................................................16
6. Reference Designs ..............................................................................................................................................17
6.1. Beacon Design .........................................................................................................................................17
6.2. Sensor Board Design ...............................................................................................................................18
7. Packaging & Ordering information....................................................................................................................21
7.1. Marking ....................................................................................................................................................21
7.2. Prototype Packaging ................................................................................................................................21
7.3. Jedec Trays..............................................................................................................................................21
7.4. Tape and Reel..........................................................................................................................................22
7.5. Ordering Information.................................................................................................................................23
8. Storage & Soldering information .......................................................................................................................24
8.1. Storage and Handling...............................................................................................................................24
8.2. Moisture Sensitivity...................................................................................................................................24
8.3. Soldering information................................................................................................................................25
9. Quality & User information.................................................................................................................................26
9.1. Certifications ............................................................................................................................................26
9.2. USA User information ............................................................................................................................26
9.3. Canada User information.......................................................................................................................26
9.4. RF Exposure Information..........................................................................................................................27
9.5. Informations concernant l'exposition aux fréquences radio (RF) ................................................................27
9.6. Discontinuity.............................................................................................................................................27
9.7. Disclaimer ................................................................................................................................................28
December 14, 2018
Page 2/28
Document Ref: isp_ble_DS1507_R12.docx
Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia-Antipolis Cedex France www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission.
Specification subject to change without notice.





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