Energy Module. ISP130301 Datasheet

ISP130301 Module. Datasheet pdf. Equivalent

Part ISP130301
Description Bluetooth Low Energy Module
Feature BLE MODULE ISP130301 HOME  ISP130301 Bluetooth Low Energy Module with Integrated Antenna Key .
Manufacture Insight SiP
Datasheet
Download ISP130301 Datasheet



ISP130301
BLE MODULE
ISP130301
HOME 
ISP130301
Bluetooth Low Energy Module
with Integrated Antenna
Key Features
Applications
Single Mode BLE v4.1 Slave or Master
Based on Nordic Semiconductor nRF51 family
2.4GHz low energy RF Transceiver
32bit ARM Cortex M0 CPU
256kB Flash and 16 kB SRAM
Analog and Digital peripherals
Ultra Low Power Consumption
Single 1.8 to 3.6 V supply
Very small size 8.0 x 11.0 x 1.2 mm
Temperature -40 to 75 °C
Fully integrated RF matching and Antenna
Integrated 16 MHz and 32.768 kHz Clocks
Certifications
Complies with FCC
Complies with CE
Complies with IC
Complies with TELEC
Bluetooth SIG certified
RoHS compliant
Space constrained BLE Slave Devices
Sport and fitness sensors
Health care sensors
Out of Range (OOR) sensors
Personal User Interface Devices (PUID)
Remote controls
General Description
This module is based on nRF51822 Nordic
Semiconductor 2.4GHz wireless System on Chip
(SoC) integrating a 2.4 GHz transceiver, a 32 bit
ARM Cortex™-M0 CPU, a flash memory, and
analog and digital peripherals. It can support BLE
and a range of proprietary 2.4 GHz protocols, such
as Gazell from Nordic Semiconductor.
Fully qualified BLE stacks for nRF51822 are
implemented in the S100 series of SoftDevices
which can be freely downloaded. ISP130301 can
then be used in Master and Slave modes for BLE
and for both ends of other proprietary protocols.
The ANT protocol can be handled on request.
The module is specifically designed for both PC
peripherals and ultra low power applications such
as sports and wellness sensors. Ultra low power
consumption and advanced power management
enables battery lifetimes up to several years on a
coin cell battery. Even though its very small size
8x11x1.2mm, the module integrates decoupling
capacitors, 16 MHz and 32 kHz crystals, load
capacitors, DC-DC converter, RF matching circuit
and antenna in addition to the wireless SoC.
The module forms a standalone BLE node
for which only the addition of a suitable DC power source is necessary for proximity or Out of Range
applications. Sensor applications require only the further addition of the appropriate sensors. As the
module has several end applications, the antenna was designed to be compatible with several ground
plane sizes such as USB dongle or cell phone.
June 1, 2015
Page 3 1
Document Ref: isp_ble_Catalog_R2.3.docx
Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia-Antipolis Cedex France www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
DISTRIBUTED BY TEXIM EUROPE



ISP130301
BLE MODULE
ISP130301
HOME 
Contents
1. Electrical Specifications ........................................................................................................... Page 3-2
2. RF Performances .................................................................................................................... Page 3-6
3. Product Development Tools .................................................................................................... Page 3-9
4. Mechanical Outlines .............................................................................................................. Page 3-10
5. Packaging ............................................................................................................................. Page 3-13
6. Storage & Soldering Information............................................................................................ Page 3-15
7. Quality & User Information..................................................................................................... Page 3-16
1. Electrical Specifications
Electrical Performance
The specifications of the module follow those of the nRF51822. The following high level parameters are
given for the module.
The operating temperature range is -40 to +75 °C with the following performances.
Parameter
Supply Voltage
Peak current, receiver active (supply at 2.1V)
Peak current,
transmitter active +4 dBm Output Power
Peak current,
transmitter active 0 dBm Output Power
Current drain, connection-less state, no RAM retention
Current drain between connection events
Crystal stability 32.768 kHz
Value
1.8 to 3.6
12.6
16
10.5
0.6
2.6
+/- 20 ppm
Unit
V
mA
mA
mA
µA
µA
Pin Assignment
The module uses an LGA format with a double row of pads on a 0.65 mm pitch. The pad layout follows
the QFN Jedec standard for 2 row LGA parts.
Pads 1 thru 56 are signal pins 0.4 x 0.4 mm, Pad 57 is an exposed metal pad that is connected to ground.
The NC pads are 0.8 x 0.8 or 0.4 x 0.4 mm and are to be connected to isolated metal pads on the
application PCB for mechanical stability and reliability (drop test).
June 1, 2015
Page 3 2
Document Ref: isp_ble_Catalog_R2.3.docx
Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia-Antipolis Cedex France www.insightsip.com
The information contained in this document is the property of Insight SiP and should not be disclosed to any third party
without written permission. Specification subject to change without notice.
DISTRIBUTED BY TEXIM EUROPE





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