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STM32WB55CC

STMicroelectronics

Multiprotocol wireless 32-bit MCU

STM32WB55xx STM32WB35xx Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® 5.4 and 802.15.4 ra...


STMicroelectronics

STM32WB55CC

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STM32WB55xx STM32WB35xx Multiprotocol wireless 32-bit MCU Arm®-based Cortex®-M4 with FPU, Bluetooth® 5.4 and 802.15.4 radio solution Datasheet - production data Features Include ST state-of-the-art patented technology Radio – 2.4 GHz – RF transceiver supporting Bluetooth® 5.4 specification, IEEE 802.15.4-2011 PHY and MAC, supporting Thread 1.3 and Zigbee® 3.0 – RX sensitivity: -96 dBm (Bluetooth® Low Energy at 1 Mbps), -100 dBm (802.15.4) – Programmable output power up to +6 dBm with 1 dB steps – Integrated balun to reduce BOM – Support for 2 Mbps – Support GATT caching – Support EATT (enhanced ATT) – Support advertising extension – Dedicated Arm® 32-bit Cortex® M0+ CPU for real-time Radio layer – Accurate RSSI to enable power control – Suitable for systems requiring compliance with radio frequency regulations ETSI EN 300 328, EN 300 440, FCC CFR47 Part 15 and ARIB STD-T66 – Support for external PA – Available integrated passive device (IPD) companion chip for optimized matching solution (MLPF-WB-01E3, or MLPF-WB55-02E3, or MLPF-WB-02D3) Ultra-low-power platform – 1.71 to 3.6 V power supply – – 40 °C to 85 / 105 °C temperature ranges – 13 nA shutdown mode – 600 nA Standby mode + RTC + 32 KB RAM – 2.1 µA Stop mode + RTC + 256 KB RAM – Active-mode MCU: < 53 µA / MHz when RF and SMPS on . UFQFPN48 7 x 7 mm solder pad VFQFPN68 8 x 8 mm solder pad FBGA WLCSP100 0.4 mm pitch UFBGA129 0.5 mm pitch – Radio: Rx 4.5 mA / Tx at 0 dBm 5.2 mA Core: Arm® 32-bit Cortex®-M4 CP...




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