F980J107MSA Datasheet (data sheet) PDF





F980J107MSA Datasheet, Resin-Molded Chip

F980J107MSA   F980J107MSA  

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F98 Series Resin-Molded Chip, High CV Un dertab FEATURES • Compliant to the R oHS2 directive 2011/65/EU • SMD face down design • Small and low profile A PPLICATIONS • Smartphone • Mobile p hone • Wireless module • Hearing ai d LEAD-FREE COMPATIBLE COMPONENT CASE DIMENSIONS: millimeters (inches) Code M S EIA Code EIA Metric 0603 1608-09 0805 2012-09 L 1.60 +0.20 -0.10 (0. 063 +0.008 -0.004 ) 2.00 +0.20 -0.1 0 (0.079 +0.008 -0.004 ) U 0402 1 106-06 1.10±0.05 (0.043±0.002) W1 0.85 +0.20 -0.10 (0.033 +0.008 -0.0 04 ) 1.25 +0.20 -0.10 (0.049 +0.00 8 -0.004 ) 0.60±0.05 (0.024±0.002) W2 0.65±0.10 (0.026±0.004) 0.90±0.10 (0.0

F980J107MSA Datasheet, Resin-Molded Chip

F980J107MSA   F980J107MSA  
35±0.004) 0.35±0.05 (0.014±0.002) *3 F980J107MMAAXE: 1.0mm Max. H 0.80±0. 10*3 (0.031±0.004) 0.80±0.10 (0.031± 0.004) 0.55±0.05 (0.022±0.002) S1 0. 50±0.10 (0.020±0.004) 0.50±0.10 (0.0 20±0.004) 0.30±0.05 (0.012±0.002) S 2 0.60±0.10 (0.024±0.004) 1.00±0.10 (0.039±0.004) 0.50±0.05 (0.020±0.002 ) L W1 H W2 MA








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