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GS816032T-166 Dataheets PDF



Part Number GS816032T-166
Manufacturers GSI Technology
Logo GSI Technology
Description 18Mb Sync Burst SRAMs
Datasheet GS816032T-166 DatasheetGS816032T-166 Datasheet (PDF)

100-Pin TQFP Commercial Temp Industrial Temp Preliminary GS816018/32/36T-250/225/200/166/150/133 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs 250 MHz–133 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect (SCD) operation • 2.5 V or 3.3 V +10%/–10% core power supply • 2.5 V or 3.3 V I/O supply • LBO pin for Linear or Interleaved Burst mode • Internal input resistors on mode pins allow floatin.

  GS816032T-166   GS816032T-166



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100-Pin TQFP Commercial Temp Industrial Temp Preliminary GS816018/32/36T-250/225/200/166/150/133 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs 250 MHz–133 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O Features • FT pin for user-configurable flow through or pipeline operation • Single Cycle Deselect (SCD) operation • 2.5 V or 3.3 V +10%/–10% core power supply • 2.5 V or 3.3 V I/O supply • LBO pin for Linear or Interleaved Burst mode • Internal input resistors on mode pins allow floating mode pins • Default to Interleaved Pipeline mode • Byte Write (BW) and/or Global Write (GW) operation • Internal self-timed write cycle • Automatic power-down for portable applications • JEDEC-standard 100-lead TQFP package -250 -225 -200 -166 -150 -133 Unit Pipeline 3-1-1-1 tKQ tCycle 2.5 2.7 3.0 3.4 3.8 4.0 ns 4.0 4.4 5.0 6.0 6.7 7.5 ns 3.3 V 2.5 V Curr (x18) 280 255 230 200 185 165 mA Curr (x32/x36) 330 300 270 230 215 190 mA Curr (x18) 275 250 230 195 180.


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