GS8672D18BE

GS8672D18/36BE-400/333/300/250/200 165-Bump BGA Commercial Temp Industrial Temp 72Mb SigmaQuad-II™ Burst of 4 ECCRAM™ 400 MHz–200 MHz 1.8 V VDD 1.8 V and 1.5 V I/O Features On-Chip ECC with virtually zero SER Simultaneous Read and Write SigmaQuad™ Interface JEDEC-standard pinout and package Dual Double Data Rate interface Byte Write Capability Burst of 4 Read and Write 1.8 V +100/–100 mV core power supply 1.5 V or 1.8 V HSTL Interface Pipelined read operation Fully coherent read and write pipelines ZQ pin for programmable output drive strength IEEE 1149.1 JTAG-compliant Boundary Scan Pin-compatible with 18Mb, 36Mb, and 144Mb devices 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package RoHS-compliant 165-bump BGA package available SigmaQuad™ ECCRAM Overview The GS8672D18/36BE SigmaQuad-II ECCRAMs are built in compliance with the SigmaQuad-II SRAM pinout standard for Separate I/O synchronous SRAMs. They are 75,49...