Mount Fuses. SF-1206S250M-2 Datasheet

SF-1206S250M-2 Fuses. Datasheet pdf. Equivalent

SF-1206S250M-2 Datasheet
Recommendation SF-1206S250M-2 Datasheet
Part SF-1206S250M-2
Description Slow Blow Multilayer Surface Mount Fuses
Feature SF-1206S250M-2; D SinglFuse™ SF-1206SxxxM Series Features n Single blow fuse for overcurrent protection n 3216 (E.
Manufacture BOURNS
Datasheet
Download SF-1206S250M-2 Datasheet




BOURNS SF-1206S250M-2
SinglFuseSF-1206SxxxM Series Features
n Single blow fuse for overcurrent protection
n 3216 (EIA 1206) miniature footprint
n Slow blow fuse (Fusing time 5 seconds at 250 % rated current)
n UL 248-14 listed
n Surface mount packaging for automated assembly
n Multilayer SMD design
n RoHS compliant* and halogen free**
SF-1206SxxxM Series - Slow Blow Multilayer Surface Mount Fuses
Electrical Characteristics
Model
SF-1206S050M-2
SF-1206S075M-2
SF-1206S100M-2
SF-1206S150M-2
SF-1206S175M-2
SF-1206S200M-2
SF-1206S250M-2
SF-1206S300M-2
SF-1206S400M-2
SF-1206S500M-2
SF-1206S600M-2
SF-1206S700M-2
Rated Current
(Amps)
0.50
0.75
1.00
1.50
1.75
2.00
2.50
3.00
4.00
5.00
6.00
7.00
Fusing Time
Open within 5
sec. at 250 %
rated current
Resistance
(Ω) Typ.***
0.730
0.513
0.220
0.120
0.100
0.050
0.035
0.031
0.022
0.015
0.013
0.011
Rated
Voltage
DC 63 V
DC 32 V
SF-1206S800M-2
8.00
0.008
*** Resistance value measured with ≤10 % rated current at 25 °C ambient. Tolerance ±25 %.
****Melting I2t calculated at 0.001 second pre-arcing time.
Interrupting Rating
(Ω) Typ.***
DC 63 V
50 A
DC 32 V
50 A
DC 32 V
45 A
Typical
I2t (A2s) ****
0.002
0.005
0.011
0.024
0.045
0.075
0.110
0.210
0.350
0.600
1.000
1.600
2.300
Reliability Testing
No. Test
1
Soldering heat
resistance
2 Solderability
3 Thermal shock
4 Moisture resistance
5 Salt spray
6 Mechanical vibration
7 Mechanical shock
8 Life
Requirement
DCR change ≤ ±10 %
No mechanical damage
Minimum 95 % coverage
DCR change ≤ ±10 %
No mechanical damage
DCR change ≤ ±15 %
No excessive corrosion
DCR change ≤ ±10 %
No excessive corrosion
DCR change ≤ ±10 %
No mechanical damage
DCR change ≤ ±10 %
No mechanical damage
No electrical “opens” during testing.
Voltage drop change shall be less than
±20 % of initial value.
Test Condition
One dip at 260 °C for 60 seconds
One dip at 245 °C for 5 seconds
100 cycles between -65 °C and +125 °C
10 cycles
48 hour exposure, 5 % salt solution
0.4 inch D.A. or 30 G between
5-3000 Hz
1500 G, 0.5 ms, half-sine shocks
80 % rated current (75 % for ≤1 A fuses)
for 2000 hours at ambient temperature
+20 °C ~ +30 °C
Test Reference
MIL-STD-202
Method 210
MIL-STD-202
Method 208
MIL-STD-202
Method 107
MIL-STD-202
Method 106
MIL-STD-202
Method 101
MIL-STD-202
Method 204
MIL-STD-202
Method 213
Refer to STP
document
Environmental Characteristics
Operating Temperature............................................ -55 °C to +125 °C
Storage Conditions
Temperature...........................................................+5 °C to +35 °C
Humidity.................................................................... 40 % to 75 %
Shelf Life..................................... 2 years from manufacturing date
Moisture Sensitivity Level...................................................................1
ESD Classification (HBM)........................................................Class 6
WARNING Cancer and Reproductive Harm
www.P65Warnings.ca.gov
Agency Recognition
UL File Number.................................................................. E198545
* RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU
June 8, 2011.
** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or
less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and
Chlorine (Cl) content is 1500 ppm or less.
“SinglFuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth
on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.



BOURNS SF-1206S250M-2
SinglFuseSF-1206SxxxM Series Applications
n Portable memory
n Cell phones
n LCD monitors
n Rechargeable battery packs
n Disk drives
n Battery chargers
n PDAs
n Set-top boxes
n Digital cameras
n Industrial controllers
n MP3 players
n Battery Management Systems (BMS)
n LED lighting
n Power tools
SF-1206SxxxM Series - Slow Blow Multilayer Surface Mount Fuses
Typical Part Marking
Represents total content. Layout may
vary.
D
RATED CURRENT (A)
C = 0.50 K = 3.00
D = 0.75 M = 4.00
E = 1.00 N = 5.00
G = 1.50 + = 6.00
H = 1.75 – = 7.00
I = 2.00
= = 8.00
J = 2.50
How to Order
SF - 1206 S 100 M - 2
SinglFuse™
Product Designator
SMD Footprint
1206 = 3216 (EIA 1206) size
Fuse Blow Type
S = Slow blow
Rated Current
050 ~ 800 (0.50 A - 8.00 A)
Structure Type
M = Multilayer
Packaging Type
- 2 = Tape & Reel
Product Dimensions
3.20 ± 0.20
(.126 ± .008)
0.51 ± 0.25
(.020 ± .010)
1.60 ± 0.20
(.063 ± .008)
1.60 ± 0.20
(.063 ± .008)
0.97 ± 0.20
(.038 ± .008)
DIMENSIONS:
MM
(INCHES)
Construction
MASKING LAYER
MARKING
FUSE ELEMENT
CERAMIC
BODY
TERMINATION
MARKING
MASKING LAYER
Packaging Quantity
3,000 pieces per 7 inch reel
Recommended Pad Layout
1.50
(.059)
1.80
(.071)
4.40
(.173)
Current Rating Thermal Derating Curve
105
100
95
90
85
80
75
70
65
60
55
50
-55 -35 -15
5
25
45 65 85
MAXIMUM OPERATING TEMPERATURE (°C)
105 125
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.



BOURNS SF-1206S250M-2
SF-1206SxxxM Series - Slow Blow Multilayer Surface Mount Fuses
Solder Reflow Recommendations
TTpP
TTLL Tsmax
Tsmax
Tsmin
Tsmin
25
25
MAXM. ARXMA.MARPXA.MDROPAWUMNPPRRUAATTPEER==A63T°°ECC=//ss3 °C/s
MAX. RAMP DOWN RATE = 6 °C/s
PREHEAT AREA
PREHEAT AREA
ts
Ts
TIME 25 °C TO PEAK
TIME 25 °C TOTPIEMAEK
TIME
Profile Feature
Pb-Free Assembly
tp
tp
Tc -5 °C
Preheat / Soak:
TC -5 °C Temperature Min. (Tsmin)
Temperature Max. (Tsmax)
tL Time (ts) from (Tsmin to Tsmax)
tL Ramp Up Rate (TL to Tp)
150 °C
200 °C
60~120 seconds
3 °C / second max.
Liquidous Temperature (TL)
Time (tL) maintained above TL
217 °C
60~150 seconds
Peak Package Body
Temperature (Tp)
260 °C
Time (tp)* within 5 °C of the
specified classification temperature 30 seconds*
(Tc)
Ramp Down Rate (Tp to TL)
6 °C / second max.
Time 25 °C to Peak Temperature 8 minutes max.
*Tolerance for peak profile temperature (Tp) is defined as a
supplier minimum and a user maximum.
Recommended Temperature Profile for Wave Soldering
10 sec. max.
260
Wave soldering is suitable for 1206 size models.
150
PREHEATING
120 seconds
TIME
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.







@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site (Privacy Policy & Contact)