Sensor Transmitter. MAX12900 Datasheet

MAX12900 Transmitter. Datasheet pdf. Equivalent

MAX12900 Datasheet
Recommendation MAX12900 Datasheet
Part MAX12900
Description Ultra-Low-Power 4-20mA Sensor Transmitter
Feature MAX12900; MAX12900 EVALUATION KIT AVAILABLE Ultra-Low-Power 4-20mA Sensor Transmitter General Description Th.
Manufacture Maxim Integrated
Datasheet
Download MAX12900 Datasheet




Maxim Integrated MAX12900
MAX12900
EVALUATION KIT AVAILABLE
Ultra-Low-Power 4-20mA Sensor Transmitter
General Description
The MAX12900 is an ultra-low-power, highly integrated
4-20mA sensor transmitter. The MAX12900 integrates
ten building blocks in a small package: a wide input supply
voltage LDO, two conditioner circuits for pulse-width-
modulated (PWM) inputs, two low-power, low-drift, general-
purpose operational amplifiers (op amp) one wide bandwidth,
zero-offset drift operational amplifier; two diagnostic
comparators, a power-up sequencer with power good
output to allow for a smooth power-up, and a low-drift
voltage reference.
The MAX12900 converts PWM data from a microcontroller
into current over a 4-20mA loop with two, three, or four-
wire configurations.
The equivalent to an ultra-low-power, high-resolution,
digital-to-analog converter is realized with the combination
of two-PWM signals received from a microcontroller, the
two conditioner circuits, and an active filter built with the
integrated low-power op amp. The outputs of the two
conditioner circuits provide a stable PWM amplitude over
voltage supply and temperature variation. The wide band-
width amplifier, in combination with a discrete transistor,
converts a voltage input into a current output and allows
HART and Foundation Fieldbus H1 signal modulation.
The zero-offset operational amplifier and the low-drift
voltage reference provide negligible error over wide
temperature. The low-power operational amplifier and
comparators provide building blocks for enhanced
diagnostic features. Supply rail monitoring, output
current readback, open circuit and failure detection are a
few examples of diagnostic features. All these features,
as well as ultra-low-power and high accuracy make the
MAX12900 ideal for loop-powered smart sensor transmitters
for industrial application.
The MAX12900 is available in 5mm x 5mm 32-pin TQFN
package and operates over a wide industrial temperature
range of -40°C to +125°C.
Benefits and Features
● Wide Input Supply Range: 4.0V to 36V
● Ultra-Low-Power Consumption: 170µA (typ)
● High Linearity: 0.01% (Max Error)
● High Resolution: Up to 16 Bit
● Low Drift Voltage Reference: 10ppm/°C max
● Wide Temperature Range: -40°C to +125°C
● Small Package: 5mm x 5mm x 0.8mm 32-pin TQFN
Applications
● Loop-Powered 4-20mA Current Transmitter
● Smart Sensors
● Remote Instrumentation
● Industrial Automation and Process Control
Ordering Information appears at end of data sheet.
19-100086; Rev 2; 3/18



Maxim Integrated MAX12900
MAX12900
Ultra-Low-Power 4-20mA Sensor Transmitter
Functional Block Diagram
VCC VCCI VCCID PWRGOOD VDD
LDOFB
1.2V
VREF
COMP2N
COMP2P
COMP1N
COMP1P
OP1N
OP1P
OP2N
OP2P
OP3N
OP3P
REFGND
VCCI
2.5V
VREF
VCCI
LDO
POWER-UP
SEQUENCER
VCCI
VDD
MAX12900
COMP2O
VCCI
VDD
COMP1O
COMPARATORS
VCCI
OP1
VCCI
OP2
VCCI
OP3
OP-AMPS
VCCI
VREF
REFBUF
OP1O
OP2O
OP3O
MAX12900 INTEGRATES 10 BUILDING BLOCKS:
LDO
POWER-UP SEQUENCER
TWO COMPARATORS (COMP1, COMP2)
TWO GENERAL PURPOSE OP AMPS (OP1, OP2)
ONE LOW DRIFT OP AMP (OP3)
2.5V PRECISION REFERENCE
TWO PWM RECEIVERS (PWMA, PWMB)
REFO
PWMAP
PWMBP
SHDN
VCCI
1V
VCCI
1V
SHDN
REFBUF
PWM
PWMAO
PWMBO
EP
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Maxim Integrated MAX12900
MAX12900
Ultra-Low-Power 4-20mA Sensor Transmitter
Absolute Maximum Ratings
VCC to GND...........................................................-0.3V to +40V
VCC to VCCI..........................................................-0.3V to +40V
VCCI and VCCID to GND........................................-0.3V to +6V
VCCI to VCCID......................................................-0.3V to +0.3V
VDD to GND.............................................................-0.3V to +6V
PWRGOOD to GND................................... -0.3V to VCCI + 0.3V
LDOFB to GND.......................................... -0.3V to VCCI + 0.3V
I/C and REFGND to GND....................................-0.3V to + 0.3V
SHDN to GND............................................ -0.3V to VCCI + 0.3V
REFO to GND............................................ -0.3V to VCCI + 0.3V
Op Amps
OP1O, OP2O, OP3O to GND.................... -0.3V to VCCI + 0.3V
OP1P, OP1N, OP2P, OP2N, OP3P,
OP3N to GND.......................-0.3V to min [4.5V, VCCI + 0.3V]
Current into OP1P, OP1N, OP2P, OP2N,
OP3P, OP3N..................................................................±20mA
Current into OP3O............................................................±30mA
Output Short-Circuit Duration for OP1 and
OP2 to VCCI or GND.............................................Continuous
Comparators
COMP1P, COMP1N, COMP2P, COMP2N
to GND.................................................... -0.3V to VCCI + 0.3V
COMP1O, COMP2O to GND...................... -0.3V to VDD + 0.3V
Current into COMP1P, COMP1N,
COMP2P, COMP2N......................................................±20mA
Output Short-Circuit Duration to
VDD or GND...........................................................Continuous
PWM Conditioners
PWMAP, PWMBP to GND.......................... -0.3V to VCCI + 0.3V
PWMAO, PWMBO to GND........................ -0.3V to VCCI + 0.3V
Current into PWMAP, PWMBP..........................................±20mA
Output Short-Circuit Duration to VCCI or GND..........Continuous
Continuous Power Dissipation (TA = +70°C,
derate 35.7mW/°C above +70°C)............................2857.1mW
Operating Temperature Range.......................... -40°C to +125°C
Functional Temperature Range
(Startup condition)......................................... -55°C to +125°C
Maximum Junction Temperature......................................+150°C
Storage Temperature Range............................. -65°C to +150°C
Soldering Temperature (reflow)........................................+260°C
Lead Temperature............................................................+300°C
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these
or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
device reliability.
Package Information
32 TQFN
PACKAGE CODE
Outline Number
Land Pattern Number
Thermal Resistance, Four-Layer Board:
Junction to Ambient (θJA)
Junction to Case (θJC)
T3255
21-0140
90-0015
40.2°C/W
2.0°C/W
For the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”,
“#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing
pertains to the package regardless of RoHS status.
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
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