Value Chip. FC4T Datasheet

FC4T Chip. Datasheet pdf. Equivalent

FC4T Datasheet
Recommendation FC4T Datasheet
Part FC4T
Description Metal Foil Low Value Chip
Feature FC4T; FC4T Series Metal Foil Low Value Chip The FC4T chip features four terminals, also known as a “Kelvin.
Manufacture OHMITE
Datasheet
Download FC4T Datasheet





OHMITE FC4T
FC4T Series
Metal Foil Low Value Chip
The FC4T chip features four terminals, also known
as a “Kelvin” configuration. This configuration
enables current to be applied through two opposite
terminals and a sensing voltage to be measured
across the other two terminals, eliminating the resis-
tance and temperature coefficient of the terminals
for a more accurate current measurement. Ohmite’s
proprietary Metal Foil technology offers an excellent
Temperature Coefficient of Resistance (TCR) even
for very low resistance values ( down to 50ppm).
Series Specifications
Pkg.
Series
Size
FC4T 1206
Power Resistance
Rating
Range
TCR
(W @70°C)
(Ω)
(ppm/°C)
0.5W 0.005-0.100 50ppm
Tolerance
0.5%, 1%
c h a r a ct e r i st i cs
Resistance
Operating Temp. Range
Rated Power
Resistance Tolerance
Temperature Coefficient
Coating Material
Terminals
Max. Current
Res. of Electrodes
0.005-0.100
-55°C to +155°C
0.5 watt
0.5% and 1% standard
within ±50ppm, ±100ppm for 5mΩ
Epoxy resin
Cu/Ni/Sn
√(Max. power÷ Resistance value)
<5mΩ
Construction
Epoxy resin marking
Cu-alloy resistor
Alumina Substrate
Epoxy resin
protection coat
Electrode (Cu+Ni+Sn)
Derating
100
80 -55°
70°
60
40
20 155°
0
-75 -50 0
50 100 150 175°
Ambient Temperature, °C
Peeling Strength of Seal Tape
F = Peel-back force: 0.1 - 0.7N (10 - 71gf)
165°~180°
F
12 1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com
(continued)



OHMITE FC4T
FC4T Series
Metal Foil Low Value Chip
p e r f o r m a n c e c h a r a ct e r i st i cs
Test Items Performance
Short time overload ±(1.0%+0.5mΩ)
High Temp. Exposure ±(1.0%+0.5mΩ)
Low Temp. Storage ±(1.0%+0.5mΩ)
Moisture Load Life ±(2.0%+0.5mΩ)
Thermal Shock
Load Life at 70ºC
Solderability
Resistance to Solder Heat
Mechanical Shock
Substrate Bending
±(1.0%+0.5mΩ)
±(2%+0.5mΩ)
The covered area >95%
±(1.0%+0.5mΩ)
±(1.0%+0.5mΩ)
±(1.0%+0.5mΩ)
Test Methods
P= 2.5Pr; T=25 ±2ºC, t=5sec.; IEC60115-1 4.13
T=+170 ±2ºC; t=1000h; IEC60115-1 4.25
T=-55 ±2ºC; t=1000h; IEC60115-1 4.25
Vtest=Vmax; T=60 ±2ºC; RH=95%; t= 90min ON, 30min OFF, 1000h; IEC60115-1 4.25
(60℃, 95%RH)
-55ºC 30min. / R.T. 3min. / +150ºC 30min. / R.T. 3min ], 100cycles; IEC60115-1 4.19
Vtest=Vmax; T=70 ±2ºC; t=90min ON; IEC60115-1 4.25
Dip into solder at T=245 ±5ºC, t=3 ±0.5sec.; IEC60115-1 4.17
Through Reflow T=275 ±5ºC, t=20 ±1sec.; IEC60115-1 4.18
a=100G, t=11ms, 5 times shock; IEC60115-1 4.21
Span between fulcrums 90mm; bend width 2mm; test board glass-epoxy;
Thickness=1.6mm; IEC60115-1 4.33
(mm ±0.2)
dimensions
Lt
bd
c We
f
ag
Part L W a b c t d e f g
FC4T 3.2 1.6 0.6 0.55 0.3 0.6 1.10 0.30 1.2 1.8
Schematic
VV
II
V = sensing terminal
(voltage)
I = current terminal
Layout for
illustration only,
part can be
rotated 180°
without effect to
the circuit.
Tape and Reel
T
K
D0
E
F
P Direction
P2 of feed
BW
NA
A 178 ±5
N 60 ±2
W1 9 ±1
T1 D1 P A
W1
Part W
P
FC4T 8.00 ±0.30 4.00 ±0.10
P2 A B D0 F E T
2.00 ±0.10 2.05 ±0.20 3.65 ±0.20 1.50 ±0.10 3.50 ±0.10 1.75 ±0.10 0.20 ±0.10
T1
Max. 0.1
K
0.85 ±0.20
ORDERIN G IN F ORMA T ION
RoHS Compliant Standard Part Numbers
FC4TR010DER
Series
Ohms
Tolerance Tape & Reel
F = 1 % 5000/reel
D = 0.5%
1%
FC4TR005FER
FC4TR010FER
FC4TR015FER
FC4TR050FER
FC4TR100FER
0.5%
FC4TR010DER
FC4TR015DER
FC4TR050DER
FC4TR100DER
rev 1/18-3
1-866-9-OHMITE • Int’l 1-847-258-0300 • Fax 1-847-574-7522 • www.ohmite.com • info@ohmite.com
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