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Chip Resistors. CRHV2512 Datasheet

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Chip Resistors. CRHV2512 Datasheet







CRHV2512 Resistors. Datasheet pdf. Equivalent




CRHV2512 Resistors. Datasheet pdf. Equivalent





Part

CRHV2512

Description

Thick Film Chip Resistors

Manufacture

Vishay

Datasheet
Download CRHV2512 Datasheet


Vishay CRHV2512

CRHV2512; www.vishay.com CRHV Vishay Techno Thic k Film Chip Resistors, High Voltage FE ATURES • High voltage up to 3000 V • Outstanding stability < 0.5 % • F low solderable Available • Custom s izes available Available • Automati c placement capability • Tape and re el packaging available • Termination style: 3-sided wraparound termination or single termination flip chip .


Vishay CRHV2512

standard; 5-sided wraparound termination available • Internationally standar dized sizes • Suitable for solderabl e, epoxy bondable, or wire bondable app lications • Termination material: so lder-coated nickel barrier or solder co ated non-magnetic terminations standard ; gold, palladium silver, platinum gold , platinum silver or platinum palladium gold terminations avail.


Vishay CRHV2512

able • Multiple styles, termination m aterials and configurations, allow wide design flexibility • Epoxy bondable or wire bondable non-magnetic terminat ions available Note • Material c ategorization: for definitions of compl iance .



Part

CRHV2512

Description

Thick Film Chip Resistors

Manufacture

Vishay

Datasheet
Download CRHV2512 Datasheet




 CRHV2512
www.vishay.com
CRHV
Vishay Techno
Thick Film Chip Resistors, High Voltage
FEATURES
• High voltage up to 3000 V
• Outstanding stability < 0.5 %
• Flow solderable
Available
• Custom sizes available
Available
• Automatic placement capability
• Tape and reel packaging available
• Termination style: 3-sided wraparound termination or
single termination flip chip standard; 5-sided wraparound
termination available
• Internationally standardized sizes
• Suitable for solderable, epoxy bondable, or wire bondable
applications
• Termination material: solder-coated nickel barrier or
solder coated non-magnetic terminations standard; gold,
palladium silver, platinum gold, platinum silver or platinum
palladium gold terminations available
• Multiple styles, termination materials and configurations,
allow wide design flexibility
• Epoxy bondable or wire bondable non-magnetic
terminations available
Note
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
* This datasheet provides information about parts that are RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts
with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details
STANDARD ELECTRICAL SPECIFICATIONS
GLOBAL
MODEL
CASE SIZE
POWER RATING
P70 °C
W
MAXIMUM
WORKING
VOLTAGE (1)
V
RESISTANCE
RANGE (2)
TOLERANCE (3)
±%
TEMPERATURE
COEFFICIENT (4)
(-55 °C to +155 °C)
± ppm/°C
CRHV1206
1206
0.30
1500
2M to 100M
2M to 1G
0.5
1, 2, 5, 10, 20
100
1.1G to 8G
2, 5, 10, 20
CRHV1210
1210
0.45
1750
4M to 100M
4M to 1G
0.5
1, 2, 5, 10, 20
100
1.1G to 10G
2, 5, 10, 20
CRHV2010
2010
0.50
2000
6M to 100M
6M to 1G
1.1G to 10G
0.5
1, 2, 5, 10, 20
2, 5, 10, 20
100
11G to 35G
10M to 100M
5, 10, 20
0.5
CRHV2510
2510
0.60
2500
10M to 1G
1.1G to 10G
11G to 40G
1, 2, 5, 10, 20
2, 5, 10, 20
5, 10, 20
100
12M to 100M
0.5
CRHV2512
2512
1.0
3000
12M to 1G
1.1G to 10G
1, 2, 5, 10, 20
2, 5, 10, 20
100
11G to 50G
5, 10, 20
Notes
• For non-standard sizes, lower values or higher power rating requirement, contact factory
(1) Continuous working voltage shall be P x R or maximum working voltage, whichever is less
(2) Resistance values below 1 Gare calibrated at 100 VDC, and values of 1 Gand above are calibrated at 1000 VDC. Calibration at other
voltages available upon request
(3) Contact factory for tighter tolerances
(4) Reference only: not for all values specified. Consult factory for your size and value. The TC for “AA” option is typically 200 ppm
Revision: 18-Apr-17
1 Document Number: 68002
For technical questions, contact: te1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000





 CRHV2512
www.vishay.com
CRHV
Vishay Techno
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: CRHV1206AF100MFKFB (preferred part number format)
CRHV 1 2 0 6AF 1 0 0MFKFB
GLOBAL
MODEL
CRHV
SIZE
1206
1210
2010
2510
2512
TERMINAL
STYLE
TERMINAL
MATERIAL
RESISTANCE
VALUE
A = 3-sided
B = top only
C = 5-sided
F = nickel barrier
G = non-magnetic
A = palladium
silver
B = platinum gold
C = gold
D = platinum silver
E = platinum
palladium gold
M = M
G = G
4M70 = 4.7 M
10M0 = 10 M
1G00 = 1 G
TOLERANCE
D = ± 0.5 %
F=±1%
G=±2%
J=±5%
K = ± 10 %
M = ± 20 %
TCR
SOLDER
TERMINATION
K = 100 ppm
E = Sn100
L = 150 ppm F = Sn95/Ag5, HSD
N = 200 ppm N = No solder
R = 250 ppm S = Sn62/Pb36/Ag2,
M = 300 ppm
HSD
W = 350 ppm T = Sn90/Pb10
P = 500 ppm
Historical Part Numbering: CRHV1206AF1006F100e2 (will continue to be accepted)
CRHV
1206
A
F
1006
F
100
PACKAGING
B = bulk
F = T/R
(full reel)
1 = T/R
(1000 pcs)
5 = T/R
(500 pcs)
T = T/R
(250 pcs min.)
W = waffle tray
e2
HISTORICAL
MODEL
SIZE
TERM
STYLE
TERM
MATERIAL
RESISTANCE
VALUE
TOLERANCE
TCR
SOLDER
TERMINATION
Note
• For additional information on packaging, refer to the Surface Mount Resistor Packaging document (www.vishay.com/doc?31543)
MECHANICAL SPECIFICATIONS
Resistive element
Ruthenium oxide
Encapsulation
Glass
Substrate
96 % alumina
Termination
Solder-coated nickel barrier or solder
coated non-magnetic terminations
standard. Gold, palladium silver, platinum
gold, platinum silver, platinum palladium
gold terminations available.
Solder finish
Pure tin or tin/lead solder alloys standard.
Tin/silver or tin/lead/silver solder
alloys available.
ENVIRONMENTAL SPECIFICATIONS
Operating
temperature
-55 °C to +155 °C
Life
Less than 0.5 % change when tested
at full rated power
Short time overload
Less than 0.5 % R
DERATING CURVE
120
100
80
60
40
20
0
- 55 - 25 0
25
50 75 100 125
70
155 175
Ambient Temperature in °C
Note
• Reference only: Not for all values specified. Consult factory for
your size and value
VOLTAGE COEFFICIENT OF RESISTANCE CHART
SIZE
VALUE ()
VCR (ppm/V)
CRHV1206
2M to 199M
25
CRHV1210
4M to 200M
25
CRHV2010
6M to 99M
100M to 1G
15
20
CRHV2510
10M to 99M
100M to 1G
10
15
CRHV2512
12M to 999M
1G to 5G
10
25
FURTHER INSTRUCTIONS
Values over 200M, consult factory
Values over 200M, consult factory
Values over 1G, consult factory
Values over 1G, consult factory
Values over 5G, consult factory
Revision: 18-Apr-17
2 Document Number: 68002
For technical questions, contact: te1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000





 CRHV2512
www.vishay.com
CRHV
Vishay Techno
DIMENSIONS in inches (millimeters)
Termination Style A
(3-sided wraparound)
L
W
T
0.025 [0.635]
Max.
Termination Style C
(5-sided wraparound)
L
W
T
0.025 [0.635]
Max.
Termination Style B
(Top conductor only)
L
W
T
0.025 [0.635]
Max.
MODEL
CRHV1206
CRHV1210
CRHV2010
CRHV2510
CRHV2512
LENGTH (L)
± 0.006 (0.152)
0.125
0.125
0.200
0.250
0.250
WIDTH (W)
± 0.006 (0.152)
0.063
0.100
0.100
0.100
0.126
THICKNESS (T)
± 0.002 (0.051)
0.025
0.025
0.025
0.025
0.025
TYPE
TERMINATION
MATERIAL
TERMINATION
STYLE
TERMINATION STYLE/
MATERIAL CODE
SOLDER TERMINATION
CODE
Solderable
Nickel barrier
Non-magnetic
Epoxy bondable/
solderable
Platinum palladium gold
Wire bondable/
Epoxy bondable
Gold
Palladium silver (2)
Epoxy bondable
Platinum gold
Platinum silver
3-sided (wraparound)
Top only (flip chip)
5-sided (wraparound)
3-sided (wraparound)
Top only (flip chip)
3-sided (wraparound)
Top only (flip chip)
5-sided (wraparound)
3-sided (wraparound)
Top only (flip chip)
5-sided (wraparound)
3-sided (wraparound)
Top only (flip chip)
5-sided (wraparound)
3-sided (wraparound)
Top only (flip chip)
5-sided (wraparound)
3-sided (wraparound)
Top only (flip chip)
5-sided (wraparound)
AF
BF
CF
AG
BG
AE
BE
CE
AC
BC
CC
AA
BA
CA
AB
BB
CB
AD
BD
CD
E or T (standard);
F or S (optional) (3)
E or T (standard);
F or S (optional) (3)
N (standard);
F or S (optional) (1)
N
N
Notes
(1) Use solder termination N for applications requiring epoxy bondable mounting, and solder terminations F or S for applications requiring
solderable mounting
(2) While not recommended, palladium silver terminations could be used for solderable applications when using a solder alloy containing silver.
If the solder paste being used to solder the palladium silver terminated parts to the boards does not have a silver-based composition, then
the silver in the terminations could begin to leach when it is exposed to liquidus non-silver-based solders, causing the potential for
solderability and/or solder joint issues
(3) Standard solder plating for the nickel barrier and non-magnetic parts is solder terminations E or T. Hot solder dipped terminations F or S are
also available
PERFORMANCE
TEST
CONDITIONS OF TEST
Life
High temperature exposure
Low temperature operation
Resistance to bonding exposure
Moisture resistance
Solder mounting integrity
Solderability
MIL-STD-202, method 108, 1000 h rated power at +70 °C
MIL-STD-202, method 108
MIL-PRF-55342, paragraph 4.8.5
MIL-STD-202, methods 210
MIL-PRF-55342, paragraph 4.8.9
MIL-PRF-55342, paragraph 4.8.13, 2 kg for 30 s
MIL-STD-202, method 208
Note
• This summary is based on testing done on values up to 2 G
TEST RESULTS
(TYPICAL TEST LOTS)
± 0.5 %
± 0.2 %
± 0.05 %
± 0.1 %
± 0.06%
No evidence of mechanical damage
95 % coverage
Revision: 18-Apr-17
3 Document Number: 68002
For technical questions, contact: te1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000



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