Document
S72XS-R MCP
256 Mb (16M x 16 bit), 1.8V MirrorBit® Flash and DDR DRAM
Features
■ Power supply voltage ❐ 1.7V to 1.95V
■ Burst speed ❐ Flash = 83 MHz, 104 MHz or 108 MHz ❐ DDR DRAM = 166 MHz
■ Packages ❐ 8.0 8.0 mm, 133-ball MCP
■ Temperature range ❐ Wireless: –25 °C to +85 °C ❐ Industrial: –40 °C to +85 °C
Table 1. Memory Density
Flash Density 256 Mb
General Description
This datasheet contains information on the S72XS-R Multi-Chip Product (MCP) stacked products. Refer to the S29VS256R, S29VS128R, S29XS256R, S29XS128R datasheet (002-00833) for full electrical specifications of the Flash memory component. The S72XS series is a product line of stacked products (MCPs), and consists of: ■ S29XS family Address-High, Address-Low, Data Multiplexed
Flash memory die ■ DDR DRAM Table 1 and Table 2 lists the products covered in this datasheet.
DRAM Density S72XS256RE0
Table 2. DDR DRAM Specification Reference
Density 256 Mb
Reference Name 256 Mb (16M 1.