IS62WVS2568GBLL Datasheet (data sheet) PDF





IS62WVS2568GBLL Datasheet, 256K x 8 LOW VOLTAGE FAST SERIAL SRAM

IS62WVS2568GBLL   IS62WVS2568GBLL  

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IS62/65WVS2568GALL IS62/65WVS2568GBLL 2 56Kx8 LOW VOLTAGE, FAST SERIAL SRAM wit h SPI, SDI and SQI INTERFACE MAY 2018 KEY FEATURES • SPI-Compatible Bus I nterface: - 30/45 MHz Clock rate - SPI/ SDI/SQI mode • Single Power Supply: - VDD = 1.65V - 2.2V (IS62/65WVS2568GAL L) - VDD = 2.70V - 3.6V (IS62/65WVS2568 GBLL) • Read Latency: - SPI mode: 8 clocks - DPI mode: 4 clocks - QPI mode: 2 clocks • Low-Power CMOS Technolog y: - Read Current: 10 mA(max) at 3.6V, 45 MHz, 85°C - CMOS Standby Current: 4 A(typ) • 512K x 8-bit Organizati on: - 32-byte page • Byte, Page and Sequential mode for Reads and Writes Temperature Ranges Supported: - Indust

IS62WVS2568GBLL Datasheet, 256K x 8 LOW VOLTAGE FAST SERIAL SRAM

IS62WVS2568GBLL   IS62WVS2568GBLL  
rial (I): -40C to +85C - Automot ive (A3): -40C to +125C • RoHS Compliant - 8-pin SOIC, 8-pin TSSOP, a nd 24-ball TFBGA packages DESCRIPTION The ISSI IS62/65WVS2568GALL/GBLL are 2M bit Fast Serial static RAMs organized as 256K bytes by 8 bits. It is fabricat ed using ISSI's high-performance CMOS t echnology. The device is accessed via a simple Serial Peripheral Interface (SP I) compatible serial bus. The bus signa ls required are a clock input (SCK) plu s separate data in (SI) and data out (S O) lines. Access the device is controll ed through a Chip Select (CS#) input. A dditionally, SDI (Serial Dual Interface ) and SQI (Serial Quad Interface) is su pported if your application needs faste r data rates. This device also supports unlimited reads and writes to the memo ry array. The IS62/65WVS2568GALL/GBLL a re available in the standard packages i ncluding 8-pin SOIC, 8-pin TSSOP and 24 -ball TFBGA (6mm x 8mm). Copyright © 2018 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specifica tion and its products at any time witho ut notice. ISSI assumes no liability ar ising out of the application or use of any information, products or services d escribed herein. Customers are advised to obtain the latest version of this device specification befo








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