TM
M
MLL746 THRU MLL759
Features
• Zener Voltage 3.3V to 12V • Silicon Planar Power Zener Diodes • Standards zener voltage tolerance is ±10% , Add suffix “A” for
±5% tolerance, other tolerances are available upon request • Lead Free Finish/RoHS Compliant(Note 1) ("P" Suffix designates
RoHS Compliant. See ordering information)
Maximum Ratings
Zener Current Power Dissipation @ TA=50oC Junction Temperature Storage Temperature Range
Symbol
Ptot TJ TSTG
Value See Table 1
500 200 -65 to 200
Units
mW oC oC
Notes:1.High Temperature Solder Exemption Applied, see EU Directive Annex 7.
0.5W Silicon Planar Zener Diodes
MiniMELF
Cathode Ma
C B A
Electrical Characteristics @ 25°C Unless Otherwise Specified
Thermal resistance
Symbol
Maximum 300
Unit oC/W
Forward Voltage @ IF=200mA
VF 1.5
V
NOTE:
1) Valid provided that a distance of 8mm from case are kept
at ambient temperature 2) Power derating: 4.0mW/oC above 50oC
DIMENSIONS
INCHES
DIM MIN
MAX
A .134 .142
B .008 .016
C .055 .059
MM MIN 3.40 .20 1.40
MAX 3.60 .40 1.50
NOTE ∅
SUGGESTED SOLDER PAD LAYOUT
.165
.075
.030
w
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MLL746 thru MLL759
MCC PART NUMBER
MLL746 MLL747 MLL748 MLL749 MLL750 MLL751 MLL752 MLL753 MLL754 MLL755 MLL756 MLL757 MLL758 MLL759
NORMAL ZENER VOLTAGE Vz@ Izt VOLTS
3.3 3.6 3.9 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 10 12
TEST CURRENT
Izt mA
20 20 20 20 20 20 20 20 20 20 20 20 20 20
MAXIMUM ZENER
IMPEDANCE Zzt @ Izt OHMS 28 24 23 22 19 17 11 7.0 5.0 6.0 8.0 10 17 30
MAXIMUM
MAXIMUM REVERSE ZENER
LEAKAGE CURRENT CURRENT TYPICAL TEMP.
Ir @ Vr=1V uA @25oC uA @125oC
IZM mA
COEFFICIENT %/oC
10 30 110
-.066
10 30 100
-.058
10 30 95
-.046
2 30 85
-.033
2 30 75
-.015
1 20 70 ±.010
1 20 65 +.030
0.1 20
60
+.049
0.1 20
55
+.053
0.1 20
50
+.057
0.1 20
45
+.060
0.1 20
40
+.061
0.1 20
35
+.062
0.1 20
30
+.062
Note:
1) Tested with pulses tp= 20ms 2) Valid provided that leads are kept at ambient temperature at a
distance of 8mm from case.
3) Zener impedance derived by superimposing on IZT, a 60 cps, rms ac current equal to 10% IZT (2 mA ac)
4) Allowance has been made for the increase in VZ due to ZZ and for the increase in junction temperature as the unit approaches thermal equilibrium at the power dissipation of 400mW.
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Ordering Information
Device (Part Number)-TP
Packing Tape&Reel;2.5Kpcs/Reel
Revision: 2
www.edcon-components.com
2008/01/01
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.